Abstract: An apparatus for removing segments of a wafer adhering to an upper surface of a flat flexible carrier. The apparatus comprises a base supporting a separator plate disposed between a cassette-type conveyor and a support plate. The separator plate has a separator edge spaced apart from the conveyor to form a narrow gap. A take-up drum is rotatably mounted within the base and has a clamping member capable of gripping the leading edge of the flexible carrier. When the take-up drum is rotated by a powering mechanism the carrier is drawn along the support surface and into the narrow gap between the separator plate and conveyor. The carrier is framed to ensure that the carrier maintains its configuration during operation of the apparatus. The powering mechanism that rotates the take-up drum simultaneously actuates the conveyor. Thus, as the carrier is drawn into the narrow gap the segments of the wafer and the frame are peeled from the carrier and deposited onto the conveyor.

Abstract: An apparatus for removing segments of a wafer adhering to an upper surface of a flat flexible carrier. The apparatus comprises a base supporting a separator plate disposed between a cassette-type conveyor and a support plate. The separator plate has a separator edge spaced apart from the conveyor to form a narrow gap. A take-up drum is rotatably mounted within the base and has a clamping member capable of gripping the leading edge of the flexible carrier. When the take-up drum is rotated by a powering mechanism the carrier is drawn along the support surface and into the narrow gap between the separator plate and conveyor. The carrier is framed to ensure that the carrier maintains its configuration during operation of the apparatus. The powering mechanism that rotates the take-up drum simultaneously actuates the conveyor. Thus, as the carrier is drawn into the narrow gap the segments of the wafer and the frame are peeled from the carrier and deposited onto the conveyor.

Abstract: An apparatus for removing integrated circuit chips from a flexible carrier characterized by a base, a separator plate including a separator edge coupled to the base, a take-up drum rotatably attached to the base and adapted to draw the flexible carrier past the separator edge, a tensioning mechanism for providing a tensioning force on the flexible carrier, and a conveyor for transporting separated chips away from the separating edge. The take-up drum and conveyor mechanism are simultaneously operated by rotating a knob.