Patents by Inventor Chong Ong

Chong Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11995028
    Abstract: Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: May 28, 2024
    Assignee: Intel Corporation
    Inventors: Chee Hak Teh, Yu Ying Ong, George Chong Hean Ooi
  • Patent number: 8122323
    Abstract: A method, apparatus, and system for dynamic adjustment of an error control coding (ECC) code rate are disclosed. In one embodiment, a code rate may be changed from a first code rate to a second code rate in response to a change in a bit error rate.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: February 21, 2012
    Assignee: Intel Corporation
    Inventors: Peter Leung, Chun Fung Man, Chong Ong
  • Publication number: 20080222490
    Abstract: A method, apparatus, and system for dynamic adjustment of an error control coding (ECC) code rate are disclosed. In one embodiment, a code rate may be changed from a first code rate to a second code rate in response to a change in a bit error rate.
    Type: Application
    Filed: March 8, 2007
    Publication date: September 11, 2008
    Inventors: Peter Leung, Chun Fung Man, Chong Ong
  • Patent number: 7236996
    Abstract: A method for producing a set of random numbers using a set of digits limited to digitd falling in the range 0 through 9.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: June 26, 2007
    Inventor: Juey Chong Ong
  • Publication number: 20060201415
    Abstract: A process, for patterning a thin film that is highly resistant to conventional etching processes and that is to be deposited at a high substrate temperature, is disclosed. The process uses a liftoff method wherein a refractory material has been substituted for the conventional organic resin. The method is particularly useful for the fabrication of tunable microwave devices and ferroelectric memory elements.
    Type: Application
    Filed: March 8, 2005
    Publication date: September 14, 2006
    Inventors: Chong Ong, Chin Tan