Abstract: A packaged semiconductor device includes a semiconductor component, first and second heat dissipation means disposed between the semiconductor component and the first and second main faces, respectively, encapsulated by an encapsulant, the shape of the packaged semiconductor device being non-rectangular cuboid.

Abstract: A double sided cooling chip package is provided, wherein the package comprises a first heat sink; a second heat sink; a stacked chip arrangement comprising a first electronic chip, a second electronic chip and an interfacing substrate arranged between the first electronic chip and the second electronic chip and comprising electric circuitry on at least one main surface, wherein one of the first electronic chip and the second electronic chip is electrically connected to the electric circuitry of the interfacing substrate; and wherein the first electronic chip is attached to the first heat sink and the second electronic chip is attached to the second heat sink.

Abstract: A packaged semiconductor device includes a semiconductor component, first and second heat dissipation means disposed between the semiconductor component and the first and second main faces, respectively, encapsulated by an encapsulant, the shape of the packaged semiconductor device being non-rectangular cuboid.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a first substrate, a second substrate and a metal cap. The chips are electrically connected to the first substrate, the second substrate is disposed between the chips, and the chips and the second substrate are disposed within the metal cap.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip, a first substrate, a second substrate and a metal cap. The chips are electrically connected to the first substrate, the second substrate is disposed between the chips, and the chips and the second substrate are disposed within the metal cap.