Abstract: A probe card device including a probe structure is provided. Probes respectively pass through multiple through holes on at least two guide plates that are stacked and separated from each other, and each of the probes includes a main body, a contacting portion, a head portion, and a neck portion. The contacting portion is exposed under a lowermost guide plate. The head portion is exposed above an uppermost guide plate. The neck portion is connected between the main body and the head portion, and a part of the neck portion protrudes opposite thereof to form a protrusion portion. The protrusion portion and the main body form an included angle, the protrusion portion abuts against an upper surface of the uppermost guide plate, and a spacing between any two of the probes that are adjacent to each other is less than twice the thickness of the protrusion portion.

Abstract: The present disclosure provides a switching matrix system and an operating method thereof for semiconductor characteristic measurement. The switching matrix system is configured to: detect an assembly of at least one switching matrix module inserted into a plurality of slots of the switching matrix system; determine a user interface according to the assembly of the at least one switching matrix module inserted into the slots, wherein the user interface includes an operable object corresponding to the assembly; and provide the user interface.

Abstract: An alignment method and an alignment device thereof are provided. The alignment method includes: providing a wafer including wafer coordinate information. Two probes are respectively aligned with two bonding pads on a dicing road of the wafer, and an image capture device is used to assist the two probes to obtain actual wafer information. The wafer coordinate information is then compared with the actual wafer information to determine whether the two probes are accurately aligned with the two bonding pads on the dicing road, respectively. When an alignment position of the two probes is determined, the positions of any chips and bonding pads on the wafer can be determined.

Abstract: The present disclosure provides a probe array and a probe structure. The probe array includes a first probe structure and a second probe structure. The first probe structure includes a first body having a first end and a second end. The second probe structure includes a second body having a first end and a second end. The first end of the first body and the first end of the second body have a same sectional area on a first section. The second end of the first body and the second end of the second body have a same sectional area on a second section. The first body and the second body have different shapes.

Abstract: A test device for testing an object under test is provided. The test device includes a plurality of probe assemblies, a lower substrate, an upper substrate, a plurality of spacers, and a plurality of shielding structures. The lower substrate is used for being coupled to first contact ends of the plurality of probe assemblies. The upper substrate has a plurality of through holes. Second contact ends of the plurality of probe assemblies protrude from the upper substrate through these through holes, so as to be electrically connected to the object under test. The plurality of shielding structures is disposed between the lower substrate and the upper substrate. The plurality of shielding structures is resilient. The upper substrate, the lower substrate and the shielding structure define a plurality of accommodating regions, and each accommodating region is used for accommodating at least one of the probe assemblies.

Abstract: The present disclosure provides a guide plate structure and a probe array. The probe array includes a first probe, a second probe and a first guide plate. The first and second probes have different configurations in respect of the probe array. The first guide plate includes a first through hole and a second through hole. The first through hole receives the first probe. The second through hole receives the second probe. The first and second through holes have different configurations in respect of the guide plate.

Abstract: A probe card structure is provided. The probe card structure includes a circuit board, an adapter board, and a probe head assembly. The adapter board is disposed on one side of the circuit board, a plurality of electrically conductive pillars are formed on one surface of the adapter board that faces the circuit board. A solder ball is disposed on one end of each of the plurality of electrically conductive pillars facing the circuit board, and the adapter board is coupled to the circuit board through the solder balls of the plurality of electrically conductive pillars. The probe head assembly including a plurality of probes, the probe head assembly is coupled to the adapter board, and the plurality of probes are electrically connected to the adapter board.

Abstract: The present disclosure provides a probe device, a probe system including the probe device and an operating thereof. The operating method includes: approaching the probe device to a reference region; stopping the probe device when a first pin of a sensing module of the probe device touches the reference region; rotating the probe device and approaching the probe device to the reference region; and stopping the probe device when both the first pin and a second pin of the sensing module of the probe device touch the reference region.

Abstract: The present disclosure provides a test apparatus and a jumper thereof. The test apparatus includes a base board and the jumper. The base board has a first slot and a second slot. The first slot has a plurality of electrical contacts, and is configured to receive a plurality of pins of a device under test. The jumper is inserted into the second slot. The jumper includes a body and a plurality of first circuits. The first circuits are disposed on the body and electrically connect the electrical contacts of the first slot to a plurality of pins of a tester.

Abstract: A semiconductor structure includes a die including a circuitry disposed over a surface of the die or within the die and having specific functions for the die; a heat dissipation member attached to the die by an adhesive disposed between the surface of the die and the heat dissipation member; and a nanostructure disposed between the adhesive and the die, configured to conduct heat from the die to the heat dissipation member, protruding from the adhesive towards the surface of the die and contacting the surface of the die.

Abstract: The present disclosure provides a probe device. The probe device includes a first probe structure and a second probe structure. The first probe structure includes: a first body, a first substrate and a plurality of first probes. The first substrate is disposed on the first body. The first probes electrically connects to the first substrate and protrudes from a surface of the first substrate. The second probe structure includes: a second body, a second substrate and a plurality of second probes. The second body has a plurality of through holes. The second probes electrically connects to the second substrate and protrudes from a surface of the second body through the through holes. The length of the first probe is different from the length of the second probes.

Abstract: The present disclosure provides a probe and an elastic structure thereof. The probe includes: a first end portion, a second end portion and a plurality of elastic units. The elastic units are disposed between the first end portion and the second portion. Each elastic unit includes a first supporting element and a second supporting element, wherein the first supporting element and the second supporting element are at opposite sides of an axis, and the axis extends along a length of the probe.

Abstract: The present disclosure provides a probe structure. The probe structure includes a plurality of bodies and a plurality of protrusions. Each body includes an end portion. Each end portion has a surface. The plurality of protrusions are formed on the surfaces and extend toward a same direction. At least one protrusion is formed on each surface.

Abstract: A testing device and probe elements thereof are provided. The testing device includes a circuit substrate, a plurality of probe elements, a first housing and a second housing. The plurality of probe elements are independent of each other and arranged at fixed intervals. Each probe element comprises a body, a first contact section and a second contact section. The body is provided with a plurality of strip-shaped perforations, and the body includes a first lateral side and a second lateral side opposite to each other. The first contact section is connected to the first lateral side, and the second contact section is connected to the second lateral side. The extension direction of the first contact section relative to the body and the extension direction of the second contact section relative to the body are distinct from each other.

Abstract: A probe card device includes a printed circuit board (PCB), a space transformer, and a high-speed flexible printed circuit (FPC). The PCB includes a plurality of first connecting bodies coupled to a tester, and a plurality of second connecting bodies. The space transformer includes a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board, a plurality of general contact pads disposed on a second surface of the space transformer and contacted with a plurality of first probes, and a plurality of high-speed contact pads disposed on the second surface of the space transformer and contacted with a plurality of second probes. The high-speed FPC has a first connecting terminal coupled to the tester, and a second connecting terminal coupled to the plurality of high-speed contact pads.

Abstract: The present disclosure provides a probing apparatus for semiconductor devices using pressurized fluid to control the testing conditions. The probing apparatus includes a housing configured to define a testing chamber; a device holder positioned on the housing and configured to hold and support at least one device under test; a platen positioned on the housing and configured to retain at least one probe; a card holder positioned on the platen and configured to hold a probe card including the probe; and at least one flow line positioned in the card holder. The flow line is configured to flow a fluid therein to adjust the temperature of the device under test.

Abstract: A probe testing device having an elastic structure is provided. The probe testing device having the elastic structure includes a plurality of probe elements and a guide plate module. Each of the probe elements includes a body, a first contact segment, and a second segment, and is formed integrally. The guide plate module includes a first guide plate, a second guide plate, and a third guide plate that are parallel to each other, and the third guide plate is arranged between the first guide plate and the second guide plate. The plurality of probe elements correspondingly pass through the first guide plate, the second guide plate, and the third guide plate. The third guide plate is configured to perform a parallel movement relative to the first guide plate and the second guide plate in a direction perpendicular to an axis of the probe element.

Abstract: A light guiding device for applying to silicon photonics structure is provided. The light guiding device includes an optical transceiver and a reflective structure. The reflective structure is disposed on the optical transceiver. The reflective structure has a reflective surface facing the optical transceiver, and the reflective surface is used for reflecting at least one light transmitted between the optical transceiver and a waveguide structure of the silicon photonics structure.

Abstract: A probe card device includes a printed circuit board (PCB), a space transformer, and a high-speed flexible printed circuit (FPC). The PCB includes a plurality of first connecting bodies coupled to a tester, and a plurality of second connecting bodies. The space transformer includes a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board, a plurality of general contact pads disposed on a second surface of the space transformer and contacted with a plurality of first probes, and a plurality of high-speed contact pads disposed on the second surface of the space transformer and contacted with a plurality of second probes. The high-speed FPC has a first connecting terminal coupled to the tester, and a second connecting terminal coupled to the plurality of high-speed contact pads.

Abstract: The present disclosure provides a test apparatus and a jumper thereof. The test apparatus includes a base board and the jumper. The base board has a first slot and a second slot. The first slot has a plurality of electrical contacts, and is configured to receive a plurality of pins of a device under test. The jumper is inserted into the second slot. The jumper includes a body and a plurality of first circuits. The first circuits are disposed on the body and electrically connect the electrical contacts of the first slot to a plurality of pins of a tester.