Abstract: Embodiments include package substrates and method of forming the package substrates. A package substrate includes a dielectric over a conductive layer, and a conductive line on the dielectric. The package substrate includes a plurality of conductive bumps on a surface of the conductive line, where the conductive bumps are conductively coupled to the conductive line, and a solder resist over the conductive line and the dielectric. The surface of the conductive line may be a bottom surface, where the conductive bumps are below the conductive line and conductively coupled to the bottom surface of the conductive line, and where the conductive bumps may be embedded in the dielectric. The surface of the conductive line may be a top surface, where the conductive bumps are above the conductive line and conductively coupled to the top surface of the conductive line, and wherein the conductive bumps are embedded in the solder resist.

Abstract: Systems and methods include a communications interface configured to communicate with a network system configured to communicate with a plurality of vehicles, and control circuitry configured to receive a query from the network system, determine vehicle information based on the query, and transmit the vehicle information to the network system.

Abstract: Disclosed is a resin impregnation apparatus. The apparatus includes: a resin supply unit for supplying a resin having a predetermined viscosity downwards; a film formation unit provided at a lower side of the resin supply unit and configured to form the resin supplied from the resin supply unit into a film shape while the resin passes between a pair of rollers spaced apart from each other. The apparatus further includes a fiber supply unit for unwinding a reinforcing fiber and bringing the reinforcing fiber into contact with the film-shaped resin so that the resin is impregnated into the reinforcing fiber to form a resin-impregnated reinforcing fiber.

Abstract: An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as to include a die attachment anchor and at least one gap that separates a die bonding pad from at least one of a trace and wire bonding pad, for example. The die attachment anchor is established on top of the die bonding pad and has a depth that does not extend all the way through the die bonding pad.

Abstract: A light-emitting device having a light source die mounted within an aperture is disclosed. The aperture is covered by a die attach pad on one side. The light source die is mounted on a die attach pad within the aperture. In one embodiment, an optical coupling layer can be formed within an aperture encapsulating a light source die. A wavelength converting layer can be formed on the substrate above the optical coupling layer. The wavelength converting layer can comprise a high density layer and a low density layer. The high density layer can comprise wavelength-converting material precipitated on one side of the wavelength converting layer. The low density layer can comprise the wavelength-converting material in particle form suspended within the wavelength converting layer. In one embodiment, the wavelength converting layer may be confined within the aperture of the substrate.

Abstract: An electronics package is disclosed. The electronics package is disclosed as including a substrate core, a metal layer established on top of the substrate core, the metal layer being etched so as to include a die attachment anchor and at least one gap that separates a die bonding pad from at least one of a trace and wire bonding pad, for example. The die attachment anchor is established on top of the die bonding pad and has a depth that does not extend all the way through the die bonding pad.

Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.

Abstract: An air filter having an inlet for air and an outlet for air comprises a body having a central channel, a first side with a first area, a second side having a second area, and a middle having a middle area, positioned between the first side and the second side. The middle area is less than the first area and less than the second area. A first fan is positioned in the body near the first side, and a second fan positioned in the body near the second side, and each fan blows air in the same direction. A filter cartridge is positioned in the central channel at the middle, wherein during operation air flows from the inlet to the filter cartridge to the outlet.

Abstract: A multi-segment display is disclosed. Specifically, a low height LED-based display is disclosed that includes a number of segments. The segment construction may include a Printed Circuit Board (PCB) layer, a first substrate, and a second substrate that are laminated or otherwise connected to one another. The first and second substrates may include windows which allow light generated by a light source mounted on the PCB to exit the display and one or more of the windows may be filled with an encapsulant.

Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.

Abstract: A multi-segment display is disclosed. Specifically, a low height LED-based display is disclosed that includes a number of segments. The segment construction may include a Printed Circuit Board (PCB) layer, a first substrate, and a second substrate that are laminated or otherwise connected to one another. The first and second substrates may include windows which allow light generated by a light source mounted on the PCB to exit the display and one or more of the windows may be filled with an encapsulant.

Abstract: An air filter having an inlet for air and an outlet for air comprises a body having a central channel, a first side with a first area, a second side having a second area, and a middle having a middle area, positioned between the first side and the second side. The middle area is less than the first area and less than the second area. A first fan is positioned in the body near the first side, and a second fan positioned in the body near the second side, and each fan blows air in the same direction. A filter cartridge is positioned in the central channel at the middle, wherein during operation air flows from the inlet to the filter cartridge to the outlet.

Abstract: An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate.

Abstract: Displays and methods of manufacturing displays are disclosed herein. An embodiment of a method of manufacturing a display comprises manufacturing a circuit board; forming a hole in a material; attaching the circuit board to the material, wherein the hole forms a cavity upon attachment of the circuit board to the material; and connecting a light source to the circuit board, the light source being located within the cavity.

Abstract: Electronic substrates having cavities located therein and methods of making the substrates are disclosed herein. An embodiment of a method of making the substrate comprises manufacturing a circuit board. An adhesive film is attached to the circuit board, wherein the adhesive film has a first side facing the circuit board and a second side located opposite the first side, and wherein the second side is adhesive. At least one cavity is formed in a material. The material is adhered to the second side of the adhesive film.

Abstract: A cordless screwdriver, having a housing (12, 18) with a pistol grip (14) with an ON/OFF button (26) and a rechargeable battery (40) inserted into it, in particular fixedly and with charging contact tongues (37) associated with the battery (40), is made safer and more convenient by providing that by means of the toggle switch (26), extending in elongated fashion over the inside of the pistol grip (14) and in particular pivotably supported, a plurality of power circuits of the cordless screwdriver (10) are interruptable and closable over the actuation stroke of the toggle switch successively independently of one another.

Abstract: A light source and method for making the same are disclosed. The light source includes a substrate, a plurality of dies and a transparent layer of encapsulant. The substrate includes an insulating layer having top and bottom surfaces, the top surface having a first metal patterned layer thereon, and the bottom surface having a second metal patterned layer thereon. The first metal patterned layer has a plurality of die mounting areas thereon, and the second metal patterned layer includes a first contact layer that underlies the die mounting area, the die mounting area and the first contact layer being connected by metal lined vias at each of the die mounting areas. The transparent encapsulant covers the plurality of dies and is bonded to the first metal patterned layer and the top surface of the insulating layer.

Abstract: Transducers are oriented differently to address the skew phenomenon. This enables a greater area of the medium to be utilized for data storage, thereby increasing the storage capacity of the device implementing embodiments of the present invention.

Abstract: Methods and apparatus for configuring and storing data in a data storage device to increase storage capacity while ensuring acceptable data reliability are provided. The methods may involve providing a data zone and a risk zone, which forms an outer region of the disc and is known to have a higher risk of data access failure than the data zone. The risk zone is configured to have a first location for primary data storage and a second location for storing a backup copy of the data stored in the first location.

Abstract: Embodiments of the present invention provide for apparatus and methods for performing unload operations, including enabling read/write heads to reach a desired velocity at the ramp. Embodiments of the present invention are particularly beneficial for handheld products where low power consumption and reliability are important requirements.