Patents by Inventor Choong Hoe Kim
Choong Hoe Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240069629Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: ApplicationFiled: August 28, 2023Publication date: February 29, 2024Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Publication number: 20230411342Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 31, 2023Publication date: December 21, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
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Patent number: 11749637Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 23, 2020Date of Patent: September 5, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju, Yun Seok Song, Dong Su Ryu
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Patent number: 11742216Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: GrantFiled: August 27, 2020Date of Patent: August 29, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Publication number: 20230088061Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 29, 2022Publication date: March 23, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
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Publication number: 20210398940Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 23, 2020Publication date: December 23, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju, Yun Seok Song, Dong Su Ryu
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Publication number: 20210398936Abstract: In one example, a system can comprise a laser assisted bonding (LAB) tool comprising a stage block and a laser source facing the stage block. The stage block can be configured to support a first substrate and a first electronic component coupled with the first substrate, the first electronic component comprising a first interconnect. The laser source can be configured to emit a first laser towards the stage block to induce a first heat on the first interconnect to bond the first interconnect with the first substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: April 29, 2021Publication date: December 23, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju
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Publication number: 20210082717Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: ApplicationFiled: August 27, 2020Publication date: March 18, 2021Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Patent number: 10763129Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: GrantFiled: May 28, 2019Date of Patent: September 1, 2020Assignee: Amkor Technology, Inc.Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Publication number: 20190287816Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: ApplicationFiled: May 28, 2019Publication date: September 19, 2019Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Patent number: 10304698Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: GrantFiled: March 13, 2018Date of Patent: May 28, 2019Assignee: Amkor Technology, Inc.Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Publication number: 20180204740Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: ApplicationFiled: March 13, 2018Publication date: July 19, 2018Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Patent number: 9916989Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: GrantFiled: April 15, 2016Date of Patent: March 13, 2018Assignee: AMKOR TECHNOLOGY, INC.Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Publication number: 20170301560Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.Type: ApplicationFiled: April 15, 2016Publication date: October 19, 2017Inventors: Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu, Choong Hoe Kim
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Patent number: 9627348Abstract: Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.Type: GrantFiled: January 8, 2015Date of Patent: April 18, 2017Assignee: AMKOR TECHNOLOGY, INC.Inventors: Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon, Chan Ha Hwang, Yang Gyoo Jung
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Publication number: 20160049381Abstract: Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.Type: ApplicationFiled: January 8, 2015Publication date: February 18, 2016Inventors: Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon, Chan Ha Hwang, Yang Gyoo Jung