Patents by Inventor Choong Kead Leslie Lum

Choong Kead Leslie Lum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding machine incorporating dual-track transfer mechanism
    Patent number: 8707550
    Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: April 29, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Keng Yew James Song, Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting Yu He
  • BONDING MACHINE INCORPORATING DUAL-TRACK TRANSFER MECHANISM
    Publication number: 20110016707
    Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.
    Type: Application
    Filed: July 24, 2009
    Publication date: January 27, 2011
    Inventors: Keng Yew James SONG, Ka Shing Kenny KWAN, Choong Kead Leslie LUM, Ting Yu HE
  • Heating apparatus and method for semiconductor devices
    Patent number: 7378616
    Abstract: A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the semiconductor device and a layer of compliant material extending over at least a portion of the heating plate for mounting the semiconductor device. A holding mechanism secures the semiconductor device on the layer of compliant material during bonding of electrical contacts onto the semiconductor device while it is being heated by the heating plate.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: May 27, 2008
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Tin Kwan Bobby Chan, Choong Kead Leslie Lum