Patents by Inventor Choong Meng How

Choong Meng How has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTILAYER CONSTRUCTION FOR MOUNTING LIGHT EMITTING DEVICES
    Publication number: 20210195743
    Abstract: A flexible multilayer construction is configured for mounting an electronic device. The flexible multilayer construction includes electrically conductive spaced apart first and second pads for electrically connecting to corresponding electrically conductive first and second terminals of the electronic device. The first and second pads define a capillary groove therebetween that is at least partially filled with an electrically insulative reflective material by a capillary action.
    Type: Application
    Filed: February 15, 2017
    Publication date: June 24, 2021
    Inventors: Donato G. Caraig, Choong Meng How, Ravi Palaniswamy, Alejandro Aldrin A. Narag, II, Bing Liu
  • Flexible printed circuit and a method of fabricating a flexible printed circuit
    Patent number: 10420215
    Abstract: Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: September 17, 2019
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Siang Sin Foo, Choong Meng How
  • FLEXIBLE PRINTED CIRCUIT AND A METHOD OF FABRICATING A FLEXIBLE PRINTED CIRCUIT
    Publication number: 20150144381
    Abstract: Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.
    Type: Application
    Filed: June 29, 2012
    Publication date: May 28, 2015
    Inventors: Siang Sin Foo, Choong Meng How