Abstract: An improved method for mounting tape carrier package type integrated circuits on printed circuit boards. In the method, some of leads of the integrated circuit are preliminarily soldered with corresponding lead pattern on the printed circuit board after the integrated circuit is aligned on the printed circuit board so that the integrated circuit is prevented from being disordered while the printed circuit board including the integrated circuit aligned thereon is transferred to a soldering apparatus.

Abstract: Disclosed is a method of preventing a gold plate connector of a printed circuit board (PCB) from being contaminated during a soldering process. The disclosed method prevents the gold plate connector coupled with the printed circuit board from being contaminated during wave soldering of the printed circuit board after spreading flux over the printed circuit board on which electronic components are mounted, and the method includes the steps of: forming a strip mask in a form of a membrane by solidifying a masking solution after spreading the masking solution capable of being solidified over the gold plate connector of the printed circuit board, performing the spreading of the masking solution before the spreading of the flux; and removing the strip mask from the gold plate connector after performing the wave soldering. As a result, it is not necessary to perform a washing operation of the gold plate connector. The washing operation can be troublesome, time-consuming, and inconvenient.

Abstract: A method for mounting an integrated circuit having a plurality of leads on a PCB. In order to mount the integrated circuit having a plurality of leads on the PCB, foreign substance on the PCB is first removed and a flux is simultaneously spread over the lead patterns formed on the PCB. After that, by aligning the leads of the integrated circuit with lead patterns on the PCB on which the flux is spread, some leads of the integrated circuit is temporarily fixed to the corresponding lead patterns of the PCB. After soldering the leads of the integrated circuit to the lead patterns of the PCB by radiating an optical beam on the entire whole surface, the soldered PCB is cooled, thereby mounting the integrated circuit on the PCB.

Abstract: A tape for use in estimating how many electronic parts being fed to an electronic part inserting machine remain on the tqape and a system for using the same. More particularly, a system which counts the remaining electronic parts on the end portion of the tape and sets up a most suitable time that the presently used tape should be replaced with a new one so that the system dead time which may occur during the replacement of tape rolls is remarkably reduced. This tape includes a mark formed at the beginning of an end portion of the tape where some electronic parts are left to be fed to the electronic part inserting machine, and the mark is sensed by a sensor so that the count starts when the end portion of the tape is sensed.

Abstract: Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding block storing portion and cooled. It is then determined whether any other PCB to be soldered exists in the PCB array. If it is determined that any other PCB to be soldered exists in the PCB array, another holding block is picked up from the holding block storing portion and moved to cover an IC on the PCB of the PCB array. The above steps are repeated until all the PCBs of the PCB array to be soldered are completely soldered. If it is determined that any other PCB to be soldered does not exist in the PCB array, the PCB array is transferred to a subsequent process.

Abstract: A method of mounting an integrated circuit having a plurality of leads on a printed circuit board (PCB), by: removing foreign substances on the PCB; spreading a flux on lead patterns formed on the PCB; aligning the leads of the integrated circuit on the lead patterns on the PCB on which the flux is spread; soldering the leads and lead patterns by covering the part of a semiconductor chip of the aligned integrated circuit using a holding block and radiating an optical beam onto the whole surface thereof; and cooling the holding block and PCB which has been soldered, which prevents shorts and a poor contact generated by an earlier method. As the quality of soldering is enhanced and the lead is not pressured when soldering, the confidence of the integrated circuit after mounting is also enhanced. Moreover, by soldering all of the leads at one time, the operational time can be reduced.

Abstract: An apparatus to clean gold plated contact surfaces on printed circuit boards uses a printed circuit board guide and cleaning units in contact with the printed circuit board guide. A guide rail on the printed circuit board guide is adapted to guide the printed circuit board having contaminated gold plated contact surfaces. The cleaning units include grindstones to abrade the gold plated contact surfaces and rub off the contaminants. Embodiments are capable of achieving cleaning uniformity, reducing failure rate, and enhancing the quality of the products. The effectiveness of the invention permits operators to carry out other operations during the cleaning process. Practice of the present invention also provides improved operating conditions without problems such as those due to the presence of waste eraser particles.

Abstract: A method for washing metal masks using a cleaning liquid includes the steps of washing the metal masks before a solder printing process on printed circuit boards, washing the metal masks at least once during the solder printing process and washing the metal masks after completing the last solder printing process. The washing liquid has a composition consisting of from 1 to 5% by weight of a fluorine-based surfactant and from 95 to 99% by weight of isopropyl alcohol, the some of the constituents being 100% by weight. More preferably, the cleaning liquid is a composition consisting of 2% by weight of the fluorine-based surfactant and 98% by weight of isopropyl alcohol, the some of the constituents being 100% by weight.