Abstract: A system and method for producing a partially perforated tear line on a substrate material uses an high energy beam to ablate the substrate material at a depth less than full depth of the substrate. By varying the output energy level of the high energy beam for varying time intervals, a substrate material is weakened to provide an easy open feature without significantly reducing the tensile strength of the substrate material. The ratio of partial perforated to unablated substrate material may vary according to almost any ratio.

Abstract: A method for producing an easy open, easy tear package formed of flexible single layer or multi-layered material using a laser. The user configures a microprocessor with the sheet size, score pattern, and material parameters. The microprocessor controls the laser to score the film material to a depth less than a full depth of the material. The microprocessor modulates the laser to create tear initiation areas at predetermined locations precisely on the score line, so as to create a starting point for initiating a tear to open the package along the score line after the package is sealed.