Abstract: An apparatus includes a first substrate comprising one or more first interconnection layers, wherein a first die is coupled to a first side of the first substrate, and a second substrate comprising one or more second interconnection layers. The second die may be coupled to a first side of the second substrate, and a third die is coupled to a second side of the second substrate. The first substrate and the second substrate may be stacked together.

Abstract: A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

Abstract: In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.

Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Abstract: Techniques are disclosed by which a coding parameter is determined to encode video data resulting in encoded video data possessing a highest possible video quality. Features may be extracted from an input video sequence. The extracted features may be compared to features described in a model of coding parameters generated by a machine learning algorithm from reviews of previously-coded videos, extracted features of the previously-coded videos, and coding parameters of the previously-coded videos. When a match is detected between the extracted features of the input video sequence and extracted features represented in the model, a determination may be made as to whether coding parameters that correspond to the matching extracted feature correspond to a tier of service to which the input video sequence is to be coded.

Abstract: Techniques are disclosed by which a coding parameter is determined to encode video data resulting in encoded video data possessing a highest possible video quality. Features may be extracted from an input video sequence. The extracted features may be compared to features described in a model of coding parameters generated by a machine learning algorithm from reviews of previously-coded videos, extracted features of the previously-coded videos, and coding parameters of the previously-coded videos. When a match is detected between the extracted features of the input video sequence and extracted features represented in the model, a determination may be made as to whether coding parameters that correspond to the matching extracted feature correspond to a tier of service to which the input video sequence is to be coded.

Abstract: Techniques are disclosed for managing display of content from multi-view video data. According to these techniques, an object may be identified from content of the multi-view video. The object's location may be tracked across a sequence of multi-view video. The technique may extract a sub-set of video that is contained within a view window that is shifted in an image space of the multi-view video in correspondence to the tracked object's location. These techniques may be implemented either in an image source device or an image sink device.

Abstract: A surgical drape is provided for use in combination with imaging equipment to allow use of the imaging equipment while keeping a surgical site sterile. The surgical drape includes a main sheet having an incise area and an opening below the incise area. An expandable pocket includes an interior that is in communication with the opening. The expandable pocket includes substantially trapezoid-shaped top and bottom panels with the longer ends of the trapezoids positioned opposite the opening to provide additional pocket material for accommodating the imaging equipment while keeping the opening to a reasonable size.

Abstract: A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Abstract: A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

Abstract: Techniques are disclosed for coding high dynamic range (HDR) data. According to such techniques, HDR data may be converted to a domain of uniform luminance data. The uniform domain data may be coded by motion compensated predictive coding. The HDR data also may be coded by motion compensated predictive coding, using a coding parameter that is derived from a counterpart coding parameter of the coding of the uniform domain data. In another technique, HDR data may be coded using coding parameters that are derived from HDR domain processing but distortion measurements may be performed in a uniform domain.

Abstract: Systems and methods are disclosed for reshaping HDR video content to improve compression efficiency while using standard encoding/decoding techniques. Input HDR video frames, e.g., represented in an IPT color space, may be reshaped before the encoding/decoding process and the corresponding reconstructed HDR video frames may then be reverse reshaped. The disclosed reshaping methods may be combinations of scene-based or segment-based methods.

Abstract: Systems and methods are disclosed for reshaping HDR video content to improve compression efficiency while using standard encoding/decoding techniques. Input HDR video frames, e.g., represented in an IPT color space, may be reshaped before the encoding/decoding process and the corresponding reconstructed HDR video frames may then be reverse reshaped. The disclosed reshaping methods may be combinations of scene-based or segment-based methods.

Abstract: Techniques are disclosed for estimating quality of images in an automated fashion. According to these techniques, a source image may be downsampled to generate at least two downsampled images at different levels of downsampling. Blurriness of the images may be estimated starting with a most-heavily downsampled image. Blocks of a given image may be evaluated for blurriness and, when a block of a given image is estimated to be blurry, the block of the image and co-located blocks of higher resolution image(s) may be designated as blurry. Thereafter, a blurriness score may be calculated for the source image from the number of blocks of the source image designated as blurry.

Abstract: Video coding techniques are disclosed for resource-limited destination display devices. Input video data may be coded by converting a first representation of the input video to a resolution of a destination display and base layer coding the converted representation. Additionally, a region of interest may be predicted from within the input video. The predicted ROI may be converted to a resolution of the destination display, and the converted ROI may be enhancement layer coded. The base layer coded data and the enhancement layer data may be transmitted to the destination display where the coded base layer data is decoded and displayed until a zoom event occurs. When a zoom event occurs, both the coded base layer data and the coded enhancement layer data may be decoded and displayed. Thus, the switchover from a first field of view to an ROI view may be performed quickly.

Abstract: Techniques are disclosed for coding high dynamic range (HDR) data. According to such techniques, HDR data may be converted to a domain of uniform luminance data. The uniform domain data may be coded by motion compensated predictive coding. The HDR data also may be coded by motion compensated predictive coding, using a coding parameter that is derived from a counterpart coding parameter of the coding of the uniform domain data. In another technique, HDR data may be coded using coding parameters that are derived from HDR domain processing but distortion measurements may be performed in a uniform domain.

Abstract: Techniques are disclosed for managing display of content from multi-view video data. According to these techniques, an object may be identified from content of the multi-view video. The object's location may be tracked across a sequence of multi-view video. The technique may extract a sub-set of video that is contained within a view window that is shifted in an image space of the multi-view video in correspondence to the tracked object's location. These techniques may be implemented either in an image source device or an image sink device.

Abstract: Coding and decoding techniques are disclosed in which a plurality of coding parameter sets is transmitted between an encoder and a decoder, each of which is distinguishable from the others by a respective identifier. When a new frame of video is to be coded, an encoder may identify a coding parameter set to be applied during coding, it may code the new frame according to the identified coding parameter set, and it may transmit the coded frame to the decoder along with an identifier of the coding parameter set used during the coding. A plurality of coding parameter sets is persistent at an encoder and the decoder simultaneously.

Abstract: A module includes a PCB including a substrate, a component pad and at least one wire pad, an SMT component mounted to a component pad, a wire fence, a mold compound and a top conductive layer. Each wire pad is connected to ground by a corresponding via extending through the substrate, and the wire fence includes wire loops connected to each wire pad. The mold compound is disposed over the PCB, the SMT component and the wire fence, and defines multiple holes extending partially through the mold compound to top-edges of the wire loops, respectively, where a conductive material fills the holes. The top conductive layer is disposed over the mold compound, and is in electrical contact with the conductive material filling the holes. The wire fence, the conductive material, and the top conductive layer provide shielding of the SMT component from electromagnetic radiation.