Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: A diffusion bonded space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The disclosure includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. A capacitive dual electrode pressure sensor which is integrated into a multilayered substrate is described. The pressure sensor may be used as a gage relative to atmospheric pressure if desired for a particular application.

Abstract: The present invention provides apparatus and method for controlling mix ratio of gas supplied to a processing chamber integrated with chamber pressure. In one embodiment, an integrated controller is used to adjust mix ratio and chamber pressure. In one embodiment, the mix ratio and chamber pressure may be adjusted using a flow sensor and a control valve disposed in each gas supply line. In one embodiment, the flow sensor used in each gas supply line is insensitive to upstream pressure perturbations.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: The present invention provides apparatus and method for controlling mix ratio of gas supplied to a processing chamber integrated with chamber pressure. In one embodiment, an integrated controller is used to adjust mix ratio and chamber pressure. In one embodiment, the mix ratio and chamber pressure may be adjusted using a flow sensor and a control valve disposed in each gas supply line. In one embodiment, the flow sensor used in each gas supply line is insensitive to upstream pressure perturbations.

Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: A method and apparatus for gas control is provided. The apparatus may be used for controlling gases delivered to a chamber, controlling the chamber pressure, controlling the delivery of backside gas between a substrate and substrate support and the like. In one embodiment, an apparatus for controlling gas control includes at least a first flow sensor having a control valve, a first pressure sensor and at least a second pressure sensor. An inlet of the first flow sensor is adapted for coupling to a gas supply. A control valve is coupled to an outlet of the flow sensor. The first pressure sensor is adapted to sense a metric indicative of the pressure upstream of the first flow sensor. The second pressure sensor is adapted to sense a metric indicative of the pressure downstream of the control valve.

Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: Described is a space-conserving integrated fluid delivery system particularly useful for gas distribution in semiconductor processing equipment. The system includes integrated fluid flow network architecture, and may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded. Subsequent to diffusion bonding, a stainless steel diffusion bonded part may advantageously be treated to enhance corrosion resistance using a series of steps designed to bring more chromium to the surface of the steel.

Abstract: A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention pertains to a diffusion bonded integrated fluid flow network architecture, which includes, in addition to a layered substrate containing fluid flow channels, an in-line filter and may include various fluid handling and monitoring components. The integrated fluid delivery system that is formed from a layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: A method and apparatus for gas control is provided. The apparatus may be used for controlling gases delivered to a chamber, controlling the chamber pressure, controlling the delivery of backside gas between a substrate and substrate support and the like. In one embodiment, an apparatus for controlling gas control includes at least a first flow sensor having a control valve, a first pressure sensor and at least a second pressure sensor. An inlet of the first flow sensor is adapted for coupling to a gas supply. A control valve is coupled to an outlet of the flow sensor. The first pressure sensor is adapted to sense a metric indicative of the pressure upstream of the first flow sensor. The second pressure sensor is adapted to sense a metric indicative of the pressure downstream of the control valve.

Abstract: One embodiment of the present invention is a method for analyzing gas flow in a gas transmission unit of a gas panel that includes: (a) monitoring a measure of gas flow output from a mass flow controller included in the gas transmission unit; (b) monitoring a measure of gas pressure output from a pressure regulator included in the gas transmission unit; and (c) analyzing the measure of gas flow and the measure of gas pressure to determine whether gas flow is stable in the gas transmission unit.

Abstract: A method and apparatus for gas control is provided. The apparatus may be used for controlling gases delivered to a chamber, controlling the chamber pressure, controlling the delivery of backside gas between a substrate and substrate support and the like. In one embodiment, an apparatus for controlling gas control includes at least a first flow sensor having a control valve, a first pressure sensor and at least a second pressure sensor. An inlet of the first flow sensor is adapted for coupling to a gas supply. A control valve is coupled to an outlet of the flow sensor. The first pressure sensor is adapted to sense a metric indicative of the pressure upstream of the first flow sensor. The second pressure sensor is adapted to sense a metric indicative of the pressure downstream of the control valve.

Abstract: A CMP slurry pumping system and method which uses the slurry pump inlet pressure as input to the pump controller, and the controller adjusts pump speed to account for variations in inlet pressure.

Abstract: A CMP slurry pumping system and method which uses the slurry pump inlet pressure as input to the pump controller, and the controller adjusts pump speed to account for variations in inlet pressure.

Abstract: One embodiment of the present invention is a method for analyzing gas flow in a gas transmission unit of a gas panel that includes: (a) monitoring a measure of gas flow output from a mass flow controller included in the gas transmission unit; (b) monitoring a measure of gas pressure output from a pressure regulator included in the gas transmission unit; and (c) analyzing the measure of gas flow and the measure of gas pressure to determine whether gas flow is stable in the gas transmission unit.

Abstract: The disclosure pertains to a space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The present invention also pertains to an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Abstract: A CMP slurry pumping system and method which uses the slurry pump inlet pressure as input to the pump controller, and the controller adjusts pump speed to account for variations in inlet pressure.

Abstract: A CMP slurry pumping system which uses the slurry pump inlet pressure as input to the pump controller, and adjusts pump speed to account for variations in inlet pressure.