Abstract: A dividing apparatus divides a workpiece along projected dicing lines into chips, the workpiece being stuck to an upper surface of a protective tape mounted on an annular frame. The dividing apparatus includes a frame holding unit for holding the annular frame and a dividing unit for pressing the workpiece in the vicinity of one at a time of the projected dicing lines and dividing the workpiece into chips along the projected dicing line. The dividing unit includes a holder for holding a portion of the workpiece in the vicinity of the projected dicing line where the workpiece is to be broken, from both upper and lower surfaces of the workpiece, and a presser for pressing chips next to chips held by the holder across the projected dicing line where the workpiece is to be broken, thereby to divide the workpiece along the projected dicing line.

Abstract: A dividing apparatus divides a workpiece along projected dicing lines into chips, the workpiece being stuck to an upper surface of a protective tape mounted on an annular frame. The dividing apparatus includes a frame holding unit for holding the annular frame and a dividing unit for pressing the workpiece in the vicinity of one at a time of the projected dicing lines and dividing the workpiece into chips along the projected dicing line. The dividing unit includes a holder for holding a portion of the workpiece in the vicinity of the projected dicing line where the workpiece is to be broken, from both upper and lower surfaces of the workpiece, and a presser for pressing chips next to chips held by the holder across the projected dicing line where the workpiece is to be broken, thereby to divide the workpiece along the projected dicing line.

Abstract: A wafer processing method of dividing along a plurality of projected dicing lines set on the wafer includes a placing step of placing the wafer on a heating table with a tape interposed therebetween, the wafer having modified layers, from which to start to divide the wafer, formed therein at positions aligned with the projected dicing lines, the tape being applied to one surface of the wafer, and a dividing step of dividing the wafer on the heating table by heating with the heating table and thereafter cooling an exposed opposite surface in its entirety of the wafer with a cooing unit whereby the wafer starts being ruptured from the modified layers along the projected dicing lines due to a thermal shock caused by a temperature difference developed between the heated and cooled surfaces of the wafer.

Abstract: A method and device of fabricating a photovoltaic strip. The method includes providing a photovoltaic cell having a front surface and a back surface and forming a first grid pattern on the front surface and second grid pattern on the back surface. The first grid pattern includes a first plurality of strip columns in parallel in a first direction and a plurality of grid lines in parallel in a second direction perpendicularly crossing the first plurality of strip columns. The second grid pattern includes a plurality of blocks separated by a plurality of streets parallel in the second direction and a second plurality of strip columns parallel in the first direction. The method further includes dicing the photovoltaic cell along the plurality of streets into a plurality of photovoltaic strips. Each of the plurality of photovoltaic strips includes at least one of the plurality of grid lines.

Abstract: Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspect of the invention pertains to a nozzle assembly that provides better fluid flow over the cutting blades. Another aspect of the invention corresponds to a nozzle adjustment assembly that helps position the nozzles relative to the blades. Another aspect of the invention corresponds to spacers that reduce the problem of imbalance caused by fluid retained therein. Yet another aspect pertains to the composition of the fluid, which is distributed by the nozzle assembly to the blades.