Patents by Inventor Chris POHLHAMMER

Chris POHLHAMMER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for chucking warped wafers
    Patent number: 10381256
    Abstract: An apparatus for fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: August 13, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Pradeep Subrahmanyan, Luping Huang, Chris Pohlhammer
  • APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS
    Publication number: 20160268156
    Abstract: An apparatus tor fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck.
    Type: Application
    Filed: March 9, 2016
    Publication date: September 15, 2016
    Inventors: Pradeep Subrahmanyan, Luping HUANG, Chris POHLHAMMER