Abstract: A modular instrumentation chassis includes a backplane PCB; multiple slots located on the backplane PCB and configured to receive multiple insertable modules, respectively; an AC-DC power supply configured to generate an isolated DC output voltage; and multiple DC-DC switching regulator units corresponding to the multiple of slots, respectively, each DC-DC switching regulator unit separately receiving the isolated DC output voltage from the AC-DC power supply. Each DC-DC switching regulator unit includes at least one DC-DC switching regulator configured to convert the received isolated DC output voltage to at least one different DC voltage, respectively, available to the slot of the multiple slots corresponding to the DC-DC switching regulator unit. A switching frequency of the at least one DC-DC switching regulator in each DC-DC switching regulator unit is separately adjustable to provide the at least one different DC voltage.

Abstract: A modular instrumentation chassis includes a backplane PCB; multiple slots located on the backplane PCB and configured to receive multiple insertable modules, respectively; an AC-DC power supply configured to generate an isolated DC output voltage; and multiple DC-DC switching regulator units corresponding to the multiple of slots, respectively, each DC-DC switching regulator unit separately receiving the isolated DC output voltage from the AC-DC power supply. Each DC-DC switching regulator unit includes at least one DC-DC switching regulator configured to convert the received isolated DC output voltage to at least one different DC voltage, respectively, available to the slot of the multiple slots corresponding to the DC-DC switching regulator unit. A switching frequency of the at least one DC-DC switching regulator in each DC-DC switching regulator unit is separately adjustable to provide the at least one different DC voltage.

Abstract: A peripheral component interconnect express (PCIe) eXtensions for instrumentation (PXIe) chassis includes a backplane, multiple peripheral slots, a mezzanine card and an integrated accelerator module. The peripheral slots are located on the backplane and configured to receive insertable PXIe peripheral modules, respectively. The mezzanine card is on the backplane and configured to accommodate at least one of connectors, integrated circuits (ICs) and signal lines incorporated in the PXIe chassis. The integrated accelerator module is on the mezzanine card within the PXIe chassis and configured to accelerate processing of signals received from the PXIe peripheral modules.

Abstract: A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to a trace at a test access point and above an exposed surface of the printed circuit board to be accessible for probing by a fixture probe. The test access point structure may be designed and manufactured to permit deformation of the test access point structure upon initial probing of the test access point structure with a fixture probe to ensure electrical contact between the fixture probe and the test access point structure.

Abstract: Techniques for automating test pad insertion in a printed circuit board (PCB) design and fixture probes insertion in a PCB tester fixture are presented. A probe location algorithm predictably determines respective preferred probing locations from among respective sets of potential probing locations associated with a number of respective nets in a PCB design. Test pads, preferably in the form of bead probes, are added to the PCB design at the respective preferred probing locations along with, where feasible, one or more alternate probing locations chosen from among remaining ones of the respective sets of potential probing locations. During fixture design, nets with multiple test pads implemented in the PCB design are processed by the same probe location algorithm used during PCB design to determine the associated preferred probing location and any associated alternate probing locations for said respective nets.

Abstract: Techniques for automating probing location selection during printed circuit board (PCB) and corresponding PCB tester fixture design are presented. The invention includes a system and algorithm for selecting a probe layout comprising a set of probing locations for a printed circuit board design having a plurality of nets, at least some of which have a number of alternative possible probing locations. The system and algorithm iteratively generates a potential probe layout comprising one or more probing locations per net, and based on the potential probe layout, determines one or more regions of maximum deflection. A probing location from the potential probe layout that is located in a region of maximum deflection and is associated with a net having one or more alternative probing locations is removed from the potential probe layout and replaced in the with one of the one or more alternate probing locations associated with the net.

Abstract: A method and apparatus for detecting open defects on grounded nodes of an electrical device using capacitive lead frame technology is presented. In accordance with the method of the invention, an accessible signal node that is capacitively coupled the grounded node is stimulated with a known source signal. A capacitive sense plate is capacitively coupled to the stimulated node and grounded node of the electrical device, and a measuring device coupled to the capacitive sense plate capacitively senses a resulting signal. The value of the capacitively sensed signal is indicative of the presence or non-presence of an open defect on one or both of the grounded node and stimulated signal node.

Abstract: A method and apparatus is presented for gaining socket testability through the use of a capacitive interposer engineered to create capacitive coupling between signal nodes of a circuit assembly that the tester has access to and nodes of the socket that would not otherwise have any coupling to a testable signal node of the socket. Generally, coupling capacitance is engineered into the interposer by trace and via routing between the signal node of the socket and a location in close proximity to the inaccessible socket node such that their proximity to each other couples them together.

Abstract: Non-contact connectivity testing of joints connecting circuit junctions are improved through knowledge of characteristics of semiconductor junctions connected to component nodes of components of a device under test (DUT) to allow detection of high-impedance joints.

Abstract: A twisting fixture probe for cleaning oxides, residues or other contaminants from the surface of a solder bead probe and probing a solder bead probe on a printed circuit board during in-circuit testing.

Abstract: A method for testing for a defect condition on a node-under-implicit-test of an electrical device is presented. The technique according to the invention includes stimulating a first node of the electrical device that is capacitively coupled to the node-under-implicit-test with a known source signal, and capacitively sensing a signal on a second node of the electrical device that is capacitively coupled to the node-under-implicit-test. A defect condition such as a short or open can be determined from the capacitively sensed signal.

Abstract: Techniques for automating test pad insertion in a printed circuit board (PCB) design and fixture probe insertion in a PCB tester fixture are presented. A probe location algorithm predictably determines respective preferred probing locations from among respective sets of potential probing locations associated with a number of respective nets in a PCB design. Test pads, preferably in the form of bead probes, are added to the PCB design at the respective preferred probing locations along with, where feasible, one or more alternate probing locations chosen from among remaining ones of the respective sets of potential probing locations. During fixture design, nets with multiple test pads implemented in the PCB design are processed by the same probe location algorithm used during PCB design to determine the associated preferred and alternate probing locations for said respective nets.

Abstract: A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a non-contact connector test probe for a testing a connector of the circuit assembly. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, connector pins of a connector on the circuit assembly are capacitively coupled to a non-contact connector test probe, and an electrical characteristic is measured by a tester coupled to the non-contact connector test probe to determine continuity of electrical paths through the circuit assembly.

Abstract: A fixture assembly is presented. The fixture assembly includes a device interface assembly for mating with a device under test and a tester interface assembly for mating with the device interface assembly on one side and a tester on a second side. In the method and apparatus of the present invention, the device interface assembly includes a probe field specific to a device under test and may be changed to accommodate a different device, without changing the tester interface assembly. The tester interface assembly includes a custom electronic module and a standardized electronic module, which are both coupled to a PCB interface in the tester interface assembly. As such, both standardized and specialized test may be modified and changed without redesigning the tester interface assembly.

Abstract: A circuit board coupon testing method and apparatus. A coupon tester uses a linear actuator to carry a test head and probe(s) for an LCR meter. The linear actuator accurately steps the probe(s) over a coupon of components arranged linearly adjacent an edge of the circuit board to measure the parameters of the component. The coupon tester can be integrated with an in-circuit tester to provide further functionality, with the coupon test being carried out simultaneously with a portion of the in-circuit test such as an unpowered portion of the in-circuit test.

Abstract: A fixture assembly (100, 102) is presented. The fixture assembly includes a device interface assembly (102) for mating with a device under test and a tester interface assembly (100) for mating with the device interface assembly (102) on one side and a tester on a second side. In the method and apparatus of the present invention, the device interface assembly (102) includes a probe field specific to a device under test and may be changed to accommodate a different device, without changing the tester interface assembly. The tester interface assembly (100) includes a custom electronic module (400) and a standardized electronic module (410), which are both coupled to a PCB interface (300) in the tester interface assembly (100). As such, both standardized and specialized test may be modified and changed without redesigning the tester interface assembly (100).

Abstract: A circuit board coupon testing method and apparatus. A coupon tester uses a linear actuator to carry a test head and probe(s) for an LCR meter. The linear actuator accurately steps the probe(s) over a coupon of components arranged linearly adjacent an edge of the circuit board to measure the parameters of the component. The coupon tester can be integrated with an in-circuit tester to provide further functionality, with the coupon test being carried out simultaneously with a portion of the in-circuit test such as an unpowered portion of the in-circuit test.

Abstract: A circuit board coupon testing method and apparatus. A coupon tester uses a linear actuator to carry a test head and probe(s) for an LCR meter. The linear actuator accurately steps the probe(s) over a coupon of components arranged linearly adjacent an edge of the circuit board to measure the parameters of the component. The coupon tester can be integrated with an in-circuit tester to provide further functionality, with the coupon test being carried out simultaneously with a portion of the in-circuit test such as an unpowered portion of the in-circuit test.

Abstract: A circuit board coupon testing method and apparatus. A coupon tester uses a linear actuator to carry a test head and probe(s) for an LCR meter. The linear actuator accurately steps the probe(s) over a coupon of components arranged linearly adjacent an edge of the circuit board to measure the parameters of the component. The coupon tester can be integrated with an in-circuit tester to provide further functionality, with the coupon test being carried out simultaneously with a portion of the in-circuit test such as an unpowered portion of the in-circuit test.

Abstract: A testing system incorporating a modular primary frame having multiple mounting surfaces and mounted on a conventional probe card testing assembly is disclosed. At least one modular press assembly is attached to the primary frame. The press assembly is height adjustable relative the testing assembly and has a plurality of synchronized force-applying members. At least one conveyor rail pair may be attached to at least one primary frame mounting surface. The rail pair is configured to deliver a printed circuit board to the testing assembly and to withdraw a printed circuit board from the testing assembly. A modular interface assembly comprising a bar code reader, a board marker or other similar devices may be disposed within the primary frame and is height adjustable relative the testing assembly. A modular secondary frame attached to at least one primary frame mounting surface may house the interface.