Abstract: This invention permits use of a conventional rain gutter system and downspout, and other gutter profiles as described to be converted into a dumpable rain gutter system which can be easily cleaned. This low profile gutter tilting system, which has few moving parts, low noise level, and no unsightly housing or exposed parts, comprises a plurality of gutter supports. This system uses air or liquid as a means to activate a rotating mechanism concealed inside the supports to pivot the gutter about a common point, as to empty any debris not normally washed out of a downspout or gutter system. The system includes, in general an OG type gutter, and a gutter support, which mounts to a building facia or trim board. The gutter supports include a hinge where a first free end is connected to the back bottom edge of a gutter, and a second free end of the hinge is connected to a stationary housing that mounts to the facia board and supports a gutter. The front bottom edge is pivotally connected to the stationary housing.

Abstract: The present invention is directed to a flat cable circuit board assembly having solder joints between the flat cable's round conductors and the solder pads of a circuit board, particularly in the clockspring of an automobile. The flat cable is formed without the use of adhesives by sonically bonding a top and bottom layer of insulating material around the round conductors. The end of the flat cable is stripped so that the round conductors can be soldered to the solder pads on the circuit board using a hot bar soldering process. The use of round conductors and solder pads on the circuit board allow for greater conductor density in the flat cable.

Abstract: A method of securing a flat cable to a circuit board including the steps of providing a flat cable with a plurality of round conductors therein and a circuit board having a plurality of solder pads. The method also includes stripping an end of the flat cable to expose the round conductors therein, placing the round conductors onto the solder pads, and soldering the round conductors to the solder pads.