Patents by Inventor Christian Andrae

Christian Andrae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sawing wire and method for the cutting and lapping of hard brittle workpieces
    Patent number: 6554686
    Abstract: A sawing wire is for the simultaneous cutting and lapping of a multiplicity of wafers from a hard brittle workpiece. The sawing wire exhibits torsion. There is also a method for cutting and lapping using the sawing wire.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: April 29, 2003
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Maximilian Kaeser, Christian Andrae
  • Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece
    Patent number: 6295977
    Abstract: A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece and a wire web of a wire saw with the aid of a feed device, through the wire web which is formed by a sawing wire. The workpiece is rotated about the longitudinal axis while the wafers are being cut off. There is also a wire saw which is suitable for carrying out the method and has a device for holding and for rotating the workpiece about the longitudinal axis.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: October 2, 2001
    Assignees: Wacker Chemie GmbH, Wacker Siltronic Gesellschaft für Halbleitermaterialien AG
    Inventors: Bert Ripper, Christian Andrae, Karl Egglhuber, Holger Lundt, Helmut Kölker, Jochen Greim
  • Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers
    Patent number: 6159284
    Abstract: A process and a device will produce a cylindrical single crystal of semicuctor material with the smallest possible alignment error of the crystal lattice. A process for cutting semiconductor wafers from two or more such single crystals is by means of wire sawing. The process for producing the single crystal is as follows: (a) a single crystal with an alignment error of the crystal lattice equal to at most 1.5.degree.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: December 12, 2000
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Hans Olkrug, Holger Lundt, Christian Andrae, Josef Frumm