Patents by Inventor Christian Galler

Christian Galler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic layer as carrier for component embedded in cavity of component carrier
    Patent number: 11058004
    Abstract: A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: July 6, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Mike Morianz, Christian Galler, Gerhard Stubenberger
  • Electronic device with embedded electronic component
    Patent number: 10568210
    Abstract: An electronic device includes a component carrier with a component carrier body, an electrically conductive layer, and an adhesive structure. The electronic device further includes an electronic component which is arranged within the component carrier body. The adhesive structure is formed between a surface of the electronic component and the electrically conductive layer and covers only a part of the surface of the electronic component. A remaining part of the surface of the electronic component is covered with the component carrier body.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: February 18, 2020
    Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Christian Galler, Gerhard Stubenberger, Markus Leitgeb, Wolfgang Schrittwieser
  • Metallic Layer as Carrier For Component Embedded in Cavity of Component Carrier
    Publication number: 20190246501
    Abstract: A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.
    Type: Application
    Filed: January 28, 2019
    Publication date: August 8, 2019
    Inventors: Mike Morianz, Christian Galler, Gerhard Stubenberger
  • Electronic Device With Embedded Electronic Component
    Publication number: 20180279479
    Abstract: An electronic device includes a component carrier with a component carrier body, an electrically conductive layer, and an adhesive structure. The electronic device further includes an electronic component which is arranged within the component carrier body. The adhesive structure is formed between a surface of the electronic component and the electrically conductive layer and covers only a part of the surface of the electronic component. A remaining part of the surface of the electronic component is covered with the component carrier body.
    Type: Application
    Filed: September 1, 2016
    Publication date: September 27, 2018
    Inventors: Christian Galler, Gerhard Stubenberger, Markus Leitgeb, Wolfgang Schrittwieser