Abstract: A system includes a bus system to connect a number of components in a chain-like structure. A first control device (e.g., microcontroller or microprocessor) is configured to control the components in a first mode of the system. A second control device (e.g., microcontroller or microprocessor) is configured to control a first subset of the components in a second mode of the system.

Abstract: In accordance with an embodiment, a method includes generating a clock signal; generating a switching signal based on the clock signal; generating a synchronization signal having an edge transition corresponding to a predetermined phase of the switching signal; transmitting the synchronization signal to a master controller; receiving a frequency adjustment command from the master controller based on the transmitted synchronization signal; and adjusting a frequency of the clock signal based on the frequency adjustment command.

Abstract: A system includes multiple devices connected in a chain-like structure, each device of the multiple devices coupled to at least one bus. A device of the plurality of devices includes a circuit configured to detect activity of a differential signal of a bus coupled to the device to cause a wakeup of the device in response to the detection.

Abstract: A system includes a bus system to connect a number of components in a chain-like structure. A first control device (e.g., microcontroller or microprocessor) is configured to control the components in a first mode of the system. A second control device (e.g., microcontroller or microprocessor) is configured to control a first subset of the components in a second mode of the system.

Abstract: A drive circuit includes an internal oscillator and a pre-drive controller coupled to the internal oscillator. The pre-drive controller can have a switch control output configured to be coupled to a switch input. The pre-drive controller can receive switch control data, receive a clock signal, receive a synchronization signal, synchronize the internal oscillator based on the clock signal and the synchronization signal, and generate a pulse modulated switching signal at the switch control output based on the switch control data and the internal oscillator.

Abstract: Supply voltage switching circuitry that is configured to dynamically switch between a battery supply voltage and a boost supply voltage, that is generated from the battery supply voltage, to power half-bridge driver circuitry based on an on-going evaluation of one or more system parameters.

Abstract: A drive circuit includes an internal oscillator and a pre-drive controller coupled to the internal oscillator. The pre-drive controller can have a switch control output configured to be coupled to a switch input. The pre-drive controller can receive switch control data, receive a clock signal, receive a synchronization signal, synchronize the internal oscillator based on the clock signal and the synchronization signal, and generate a pulse modulated switching signal at the switch control output based on the switch control data and the internal oscillator.

Abstract: Systems and techniques are described for monitoring the operating temperature of one or more circuit elements, such as a metal oxide field effect transistor (MOSFET) switch, where the circuit element is used to control at least one phase of an electric motor. The systems and techniques may calculate temperature by determining at least two electrical signals from the circuit element taken at least two different times. This results in an accurate temperature calculation without requiring precise knowledge of the particular characteristics of each respective circuit element.

Abstract: Systems and techniques are described for monitoring the operating temperature of one or more circuit elements, such as a metal oxide field effect transistor (MOSFET) switch, where the circuit element is used to control at least one phase of an electric motor. The systems and techniques may calculate temperature by determining at least two electrical signals from the circuit element taken at least two different times. This results in an accurate temperature calculation without requiring precise knowledge of the particular characteristics of each respective circuit element.

Abstract: A system includes multiple devices connected in a chain-like structure, each device of the multiple devices coupled to at least one bus. A device of the plurality of devices includes a circuit configured to detect activity of a differential signal of a bus coupled to the device to cause a wakeup of the device in response to the detection.

Abstract: In one example, a method includes generating, by a main switching element of a device, a load current; generating, by a regulation loop of the device, a sense current proportional to the load current; directly converting, by an analog-to-digital converter (ADC) of the device, the sense current into a digital sense current value; and outputting, by the device and to an external device, a digital representation of the load current based on the digital sense current value.

Abstract: A device is operated in a low power mode of operation. The device receives a differential signal that includes a first polarity signal and a second polarity signal. A slope of a first direction is detected in the differential signal and a slope of a second direction is detected in the differential signal. A wakeup of the device is caused in response to the detection of the first slope of the differential signal and the second slope of the differential signal.

Abstract: In one example, a method includes generating, by a main switching element of a device, a load current; generating, by a regulation loop of the device, a sense current proportional to the load current; directly converting, by an analog-to-digital converter (ADC) of the device, the sense current into a digital sense current value; and outputting, by the device and to an external device, a digital representation of the load current based on the digital sense current value.

Abstract: A device is operated in a low power mode of operation. The device receives a differential signal that includes a first polarity signal and a second polarity signal. A slope of a first direction is detected in the differential signal and a slope of a second direction is detected in the differential signal. A wakeup of the device is caused in response to the detection of the first slope of the differential signal and the second slope of the differential signal.

Abstract: A system including a bus, and a method to transmit data over a bus system are disclosed. According to an embodiment, a method to transmit data over a bus system includes deliberately delaying the transmission of data. The deliberate delay caused by deliberately delaying the transmission of data may be chosen to predominate stochastic delay differences.

Abstract: A system includes a bus system to connect a number of components in a chain-like structure. A first control device (e.g., microcontroller or microprocessor) is configured to control the components in a first mode of the system. A second control device (e.g., microcontroller or microprocessor) is configured to control a first subset of the components in a second mode of the system.

Abstract: A system including a bus, and a method to transmit data over a bus system are disclosed. According to an embodiment, a method to transmit data over a bus system includes deliberately delaying the transmission of data. The deliberate delay caused by deliberately delaying the transmission of data may be chosen to predominate stochastic delay differences.

Abstract: A semiconductor component comprises a semiconductor body including a front side and a number of cell strips. Each of the cell strips includes a terminal zone of a first type arranged on the front side of the semiconductor body and a terminal zone of a second type arranged on the front side of the semiconductor body. A patterned first metallization layer, a patterned second metallization layer, and a patterned third metallization layer are arranged successively on the front side. A first plurality of conductive lines are formed in the first metallization layer and a second plurality of conductive lines are formed in the second metallization layer. The second plurality of conductive lines cross the first plurality of conductive lines at crossover locations. The second plurality of conductive lines are electrically conductively connected to the first plurality of conductive lines at predetermined crossover locations.

Abstract: A semiconductor component comprises a semiconductor body including a front side and a number of cell strips. Each of the cell strips includes a terminal zone of a first type arranged on the front side of the semiconductor body and a terminal zone of a second type arranged on the front side of the semiconductor body. A patterned first metallization layer, a patterned second metallization layer, and a patterned third metallization layer are arranged successively on the front side. A first plurality of conductive lines are formed in the first metallization layer and a second plurality of conductive lines are formed in the second metallization layer. The second plurality of conductive lines cross the first plurality of conductive lines at crossover locations. The second plurality of conductive lines are electrically conductively connected to the first plurality of conductive lines at predetermined crossover locations.