Abstract: A module for a mobile radio device is proposed, whose central element is a multiswitch MS, which, as desired, can connect outputs for transmission and/or reception branches SZ, EZ of different mobile radio systems to an antenna ANT. The module is suitable for a multiband operation and, optionally, additional multimode operations and includes at least one pair of outputs for transmission and reception branches of a frequency duplexed mobile radio system. Between each output of the multiswitch and the antenna, a matching element is provided, which allows an electrical matching of the branches to be connected to it. The duplex operation is carried out via separate transmission and reception filters, or on the switch via separate outputs for transmission and reception branches.

Abstract: A front-end module is for use with at least three radio frequency bands. The front-end module includes at least five signal paths, and an antenna switch to electrically connect an antenna to one of the signal paths. At least one of the signal paths includes subpaths. A frequency separating network interfaces the at least one signal path to the subpaths. The subpaths are for use in passing different radio frequency bands. The different radio frequency bands have frequency ranges that do not overlap.

Abstract: In a configuration with at least one RF component disposed in a signal path and including a ground connection to an external circuit environment, a coupling element is provided which electromagnetically couples to at least part of the ground connection and at the same time decouples a coupling current. By suitably feeding this coupling current back into the signal path of the component, the negative influence of the inductance of the ground connection on the signal path is thus compensated for.

Abstract: An electrical module with a first substrate, and a component mounted on the first substrate is specified. The component includes a second substrate and a chip arranged on the second substrate. In the module, a filter circuit is realized that includes shunt arms connected to ground each with at least one parallel resonator. The parallel resonators are arranged on the chip. The ground-side connection of at least two of the shunt arms to each other is realized outside the chip and the second substrate. The ground-side connection of the shunt arms is advantageously realized in the first substrate or on a circuit board on which the first substrate is arranged.

Abstract: An electrical component with a filter circuit is specified that includes a first bandstop filter and a second bandstop filter. The first bandstop filter includes at least one resonator operating with acoustic waves and has a first stop band. The second bandstop filter includes LC elements and has a second stop band that lies at least one octave higher than the first stop band.

Abstract: An amplifier module includes an integrated circuit device including a first amplifier circuit electrically connected to a first input terminal. The amplifier circuit includes a number of x first amplifier branches electrically connected to the first input terminal. The amplifier module also includes a number y of first output terminals each assigned to a respective TX frequency band, a first switching unit that electrically connects one or more of the first amplifier branches to one of the first output terminals, and a multilayer substrate, on top of which the integrated circuit device and the switching unit are mounted. The substrate includes integrated passive matching elements that are part of matching circuits where x?1 and y?2. Each of the first amplifier branches is adapted to deliver a different power level at its output and is matched to a load at the first output terminals by one of the matching circuits.

Abstract: An amplifier module includes an integrated circuit device including a first amplifier circuit electrically connected to a first input terminal. The amplifier circuit includes a number of x first amplifier branches electrically connected to the first input terminal. The amplifier module also includes a number y of first output terminals each assigned to a respective TX frequency band, a first switching unit that electrically connects one or more of the first amplifier branches to one of the first output terminals, and a multilayer substrate, on top of which the integrated circuit device and the switching unit are mounted. The substrate includes integrated passive matching elements that are part of matching circuits where x?1 and y?2. Each of the first amplifier branches is adapted to deliver a different power level at its output and is matched to a load at the first output terminals by one of the matching circuits.

Abstract: In a configuration with at least one RF component disposed in a signal path and including a ground connection to an external circuit environment, a coupling element is provided which electromagnetically couples to at least part of the ground connection and at the same time decouples a coupling current. By suitably feeding this coupling current back into the signal path of the component, the negative influence of the inductance of the ground connection on the signal path is thus compensated for.

Abstract: An electrical module with a first substrate, and a component mounted on the first substrate is specified. The component includes a second substrate and a chip arranged on the second substrate. In the module, a filter circuit is realized that includes shunt arms connected to ground each with at least one parallel resonator. The parallel resonators are arranged on the chip. The ground-side connection of at least two of the shunt arms to each other is realized outside the chip and the second substrate. The ground-side connection of the shunt arms is advantageously realized in the first substrate or on a circuit board on which the first substrate is arranged.

Abstract: An electrical component with a filter circuit is specified that includes a first bandstop filter and a second bandstop filter. The first bandstop filter includes at least one resonator operating with acoustic waves and has a first stop band. The second bandstop filter includes LC elements and has a second stop band that lies at least one octave higher than the first stop band.

Abstract: A module for a mobile radio device is proposed, whose central element is a multiswitch MS, which, as desired, can connect outputs for transmission and/or reception branches SZ, EZ of different mobile radio systems to an antenna ANT. The module is suitable for a multiband operation and, optionally, additional multimode operations and includes at least one pair of outputs for transmission and reception branches of a frequency duplexed mobile radio system. Between each output of the multiswitch and the antenna, a matching element is provided, which allows an electrical matching of the branches to be connected to it. The duplex operation is carried out via separate transmission and reception filters, or on the switch via separate outputs for transmission and reception branches.

Abstract: A front-end module is for use with at least three radio frequency bands. The front-end module includes at least five signal paths, and an antenna switch to electrically connect an antenna to one of the signal paths. At least one of the signal paths includes subpaths. A frequency separating network interfaces the at least one signal path to the subpaths. The subpaths are for use in passing different radio frequency bands. The different radio frequency bands have frequency ranges that do not overlap.

Abstract: An electrical multiband component includes at least three signal paths, each for the transmitting signals in a corresponding frequency band. A frequency-separating filter includes an input side and an output side. The input side is electrically connected to an antenna path and the output side is electrically connected to the signal paths. A bandpass filter includes a double mode surface acoustic wave (SAW) filter in at least one of the signal paths.

Abstract: A resonator system and method are provided which includes/uses a tunable reference resonator, parts for tuning the reference resonator to a reference value via a controlled variable for the reference resonator, a tunable circuit resonator, and parts for tuning the circuit resonator which are designed such that the controlled variable for the reference resonator is used as a measure of the tuning of the circuit resonator, and wherein the reference resonator and/or the circuit resonator is/are designed as a surface acoustic wave component, a bulk acoustic wave component and/or a diaphragm oscillator.

Abstract: A component that functions with bulk acoustic waves, particularly a bandpass filter, has an increased number of degrees of design freedom in order to improve the transmission characteristics of the component. The component has BAW resonators coupled acoustically in the vertical and/or lateral direction through common electrodes, coupling layer systems and through the excitation of lateral acoustic modes. Through the acoustic coupling of the resonators, it is possible to create additional pole points in the transfer function so that in this manner, the rejection band characteristics of a bandpass filter can be improved. Through acoustic paths which are added in addition to the electrical connection, the insertion loss can be reduced. Through an acoustic coupling instead of an electrical connection, decoupling between input and output loops of a circuit can be achieved.

Abstract: In a component operating with acoustic waves, a GDE layer is provided in close mechanical contact with a piezoelectric excitation layer which can significantly change their rigidity under a mechanical warping and the sound propagation speed. The degree of the material expansion or, respectively, compression can be adjusted by applying a voltage to two control voltage electrodes and a piezoelectric tuning layer.

Abstract: A component having an acoustically active material, whose acoustic constants can be at least partially altered. The acoustically active material is located at least partially at a phase transition point and/or in the vicinity of a phase transition point.

Abstract: A component that functions with bulk acoustic waves, particularly a bandpass filter, has an increased number of degrees of design freedom in order to improve the transmission characteristics of the component. The component has BAW resonators coupled acoustically in the vertical and/or lateral direction through common electrodes, coupling layer systems and through the excitation of lateral acoustic modes. Through the acoustic coupling of the resonators, it is possible to create additional pole points in the transfer function so that in this manner, the rejection band characteristics of a bandpass filter can be improved. Through acoustic paths which are added in addition to the electrical connection, the insertion loss can be reduced. Through an acoustic coupling instead of an electrical connection, decoupling between input and output loops of a circuit can be achieved.

Abstract: A component having an acoustically active material, whose acoustic constants can be at least partially altered. The acoustically active material is located at least partially at a phase transition point and/or in the vicinity of a phase transition point.

Abstract: A resonator system and method are provided which includes/uses a tunable reference resonator, parts for tuning the reference resonator to a reference value via a controlled variable for the reference resonator, a tunable circuit resonator, and parts for tuning the circuit resonator which are designed such that the controlled variable for the reference resonator is used as a measure of the tuning of the circuit resonator, and wherein the reference resonator and/or the circuit resonator is/are designed as a surface acoustic wave component, a bulk acoustic wave component and/or a diaphragm oscillator.