Abstract: A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.

Abstract: A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.

Abstract: A power semiconductor module having a housing with first connecting devices for arrangement on an external cooling component, at least one substrate carrier with power-electronics circuit arrangements constructed thereon and electrical terminal elements extending therefrom to second connecting devices for connection to external power lines, wherein the first and/or the second connecting devices are constructed as essentially hollow cylindrical metallic molded die-cast parts which are connected to the housing by injection molding.

Abstract: A power semiconductor module having at least one fuse. The power semiconductor module comprises a housing, load terminal elements that lead outside of the housing, and a substrate disposed inside the housing with a plurality of metal connecting tracks of different polarity electrically insulated from one another. On at least one of these connecting tracks, at least one power semiconductor component is disposed and is connected correctly in terms of circuitry to first connecting elements that have a first line cross section. The fuse comprises a second connecting element that has a second line cross section, less than the first, and is disposed between two connecting tracks and/or between a connecting track and a load terminal element. The second connecting element is sheathed in one portion by an explosion protection means.

Abstract: A power semiconductor module comprising a housing of a first plastic, at least one substrate carrier with a circuit constructed thereon and electric terminating elements extending therefrom. The housing includes attachment means for its permanent connection with the substrate carrier. The housing has a permanently elastic sealing device of a second plastic which is formed integrally with the housing and encircles and is directed towards a first inner main surface of the substrate carrier. A method for constructing such a module includes the steps of constructing a housing of a first mechanically stable plastic and a sealing device of a second permanently elastic plastic; disposing the at least one substrate carrier on the housing; and permanently connecting the housing to the substrate carrier.

Abstract: A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner surface (facing the interior of the module) and its outer surface. The cutout is smaller at the inner surface than at the outer surface. The housing has an extension that reaches into the cutout and may be deformed to form a riveted connection. The method comprises: forming a housing with at least one extension which extends towards the exterior of the module, wherein the extension projects through the cutout and beyond the outer surface of the carrier; and deforming the end of the extension so that it widens and forms a riveted connection and at the same time lies below the outer surface of the carrier.

Abstract: A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner surface (facing the interior of the module) and its outer surface. The cutout is smaller at the inner surface than at the outer surface. The housing has an extension that reaches into the cutout and may be deformed to form a riveted connection. The method comprises: forming a housing with at least one extension which extends towards the exterior of the module, wherein the extension projects through the cutout and beyond the outer surface of the carrier; and deforming the end of the extension so that it widens and forms a riveted connection and at the same time lies below the outer surface of the carrier.

Abstract: A power semiconductor module comprising a housing of a first plastic, at least one substrate carrier with a circuit constructed thereon and electric terminating elements extending therefrom. The housing includes attachment means for its permanent connection with the substrate carrier. The housing has a permanently elastic sealing device of a second plastic which is formed integrally with the housing and encircles and is directed towards a first inner main surface of the substrate carrier. A method for constructing such a module includes the steps of constructing a housing of a first mechanically stable plastic and a sealing device of a second permanently elastic plastic; disposing the at least one substrate carrier on the housing; and permanently connecting the housing to the substrate carrier.

Abstract: A power semiconductor module having a housing with first connecting devices for arrangement on an external cooling component, at least one substrate carrier with power-electronics circuit arrangements constructed thereon and electrical terminal elements extending therefrom to second connecting devices for connection to external power lines, wherein the first and/or the second connecting devices are constructed as essentially hollow cylindrical metallic molded die-cast parts which are connected to the housing by injection molding.

Abstract: The present invention relates to a contact maker for the gate terminal of power semiconductor components in disc cells and power semiconductor modules. Disposed above the power semiconductor component is a shaped member that incorporates in the region of the gate terminal a recess, and this recess, in turn, also incorporates a counter-support. The contact maker consists of a contact spring incorporating a pin-like extension at the end of the spring that contacts the gate terminal, and incorporating a connection created via a shaped metal element to a connecting cable for the external connection at the other end of the spring, and of an insulating sleeve with a contact spring disposed therein. The insulating sleeve itself has at least one locking projection, which, together with the counter-support of the shaped member, forms a snap-lock connection.

Abstract: A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection tracks are insulated from one another and have power semiconductor components (50) disposed on them. The housing has a cap (14) and at least one framelike housing part (12) forming the side walls thereof. This housing part (12) includes a main frame (120) and at least one locking frame (130). The main frame (120) has guides (122, 128) for receiving connection elements (30, 32). The locking frame (130) is disposed relative to the main frame (120) such that it rests at least in part on the connection tabs (310, 320) of the connection elements (30, 32), in order to prevent movemnt of the connection elements toward the substrate (40).

Abstract: A power semiconductor module having at least one fuse. The power semiconductor module comprises a housing, load terminal elements that lead outside of the housing, and a substrate disposed inside the housing with a plurality of metal connecting tracks of different polarity electrically insulated from one another. On at least one of these connecting tracks, at least one power semiconductor component is disposed and is connected correctly in terms of circuitry to first connecting elements that have a first line cross section. The fuse comprises a second connecting element that has a second line cross section, less than the first, and is disposed between two connecting tracks and/or between a connecting track and a load terminal element. The second connecting element is sheathed in one portion by an explosion protection means.

Abstract: The present invention relates to a contact maker for the gate terminal of power semiconductor components in disc cells and power semiconductor modules. Disposed above the power semiconductor component is a shaped member that incorporates in the region of the gate terminal a recess, and this recess, in turn, also incorporates a counter-support. The contact maker consists of a contact spring incorporating a pin-like extension at the end of the spring that contacts the gate terminal, and incorporating a connection created via a shaped metal element to a connecting cable for the external connection at the other end of the spring, and of an insulating sleeve with a contact spring disposed therein. The insulating sleeve itself has at least one locking projection, which, together with the counter-support of the shaped member, forms a snap-lock connection.

Abstract: A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection tracks are insulated from one another and have power semiconductor components (50) disposed on them. The housing has a cap (14) and at least one framelike housing part (12) forming the side walls thereof. This housing part (12) includes a main frame (120) and at least one locking frame (130). The main frame (120) has guides (122, 128) for receiving connection elements (30, 32). The locking frame (130) is disposed relative to the main frame (120) such that it rests at least in part on the connection tabs (310, 320) of the connection elements (30, 32), in order to prevent movemnt of the connection elements toward the substrate (40).