Abstract: Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

Abstract: A semiconductor circuit arrangement and a method for temperature detection is disclosed. One embodiment includes a semiconductor substrate, on which is formed a first insulating layer and thereon a thin active semiconductor region, which is laterally delimited by a second insulating layer. In the active semiconductor region, a first and second doping zone are formed on the surface of the first insulating layer for the definition of a channel zone, wherein there is formed at the surface of the channel zone a gate dielectric and thereon a control electrode for the realization of a field effect transistor. In the active semiconductor region, a diode doping zone is formed on the surface of the first insulating layer, which zone realizes a measuring diode via a diode side area with the first or second doping zone and is delimited by the second insulating layer at its further side areas.

Abstract: A circuit arrangement for detecting voltage changes, comprising supply terminals configured to apply a first potential and a second potential, a first oscillator and a second oscillator, which are operated with the first potential and the second potential, a voltage dependence of the frequency of the first oscillator differing from a voltage dependence of the frequency of the second oscillator, a first evaluation circuit configured to evaluate the frequency of the first oscillator and a second evaluation circuit configured to evaluate the frequency of the second oscillator, and a comparison circuit configured to compare a value based on the evaluated frequencies of the first oscillator and of the second oscillator with a predetermined threshold value, and to output a voltage change signal indicating an impermissible voltage change between the first potential and the second potential depending on the result of the comparison.

Abstract: An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs. Alternately, a FET is present in which: a channel region is the active region, the FET contains a web with opposing control electrodes connected by a connecting region that is isolated from the channel region by a thick insulating region. The thick insulating region is thicker than control electrode insulation regions. The control electrodes contain the same material as the far electrode region.

Abstract: The invention relates to an electronic component that can be operated by means of an alternating voltage. Said component includes at least one input, at least one output and a pair of electronic sub-components with an identical function. The input(s) of the electronic component is/are coupled to a respective input of the electronic sub-components with an identical function and the output(s) of the electronic component is/are coupled to a respective output of said electronic sub-components. In addition, the electronic component is configured in such a way that at least one output only one output signal of the first sub-component of the pair of functionally identical electronic components can be picked up during a first half-wave of an alternating voltage, whereas only one output signal of the second sub-component of the pair of functionally identical electronic can be picked up during the second half-wave of the alternating voltage.

Abstract: Implementations are presented herein that include a test circuit and a reference circuit.

Abstract: Pulse-generator circuit for generating an input signal for a flip-flop circuit from a clock-pulse signal and a data signal. The circuit includes a control unit for controlling a clock-pulse field effect transistor, a logic field effect transistor and a feedback field effect transistor. To generate the input signal, the control unit is configured in such a way that the clock-pulse field effect transistor is controlled chronologically after the logic field effect transistor and the feedback field effect transistor, thus generating the flip-flop signal.

Abstract: Noise-reducing transistor arrangement having first and second field effect transistors (FETs) having source terminals coupled together, drain terminals coupled together, and control terminals for application of a first or second signal. A clock generator unit is configured to provide the first and second signals alternately to the FETs with an alternating frequency which is at least as great as the cut-off frequency of the noise characteristic of the FETs, or with a reciprocal alternating frequency which is less than a mean lifetime of an occupation state of a defect in the boundary region between channel region and gate insulating layer of the FETs. The first signal is applied to the control terminal of the first FET and, simultaneously, the second signal to the control terminal of the second FET. The second signal is applied to the control terminal of the first FET and, simultaneously, the first signal to the control terminal of the second FET.

Abstract: A circuit includes a plurality of first MuGFET devices supported by a substrate and having a first performance level. A plurality of second MuGFET devices is supported by the substrate and have a second performance level. The first and second devices in one embodiment are arranged in separate areas that facilitate different processing of the first and second devices to tailor their performance characteristics. In one embodiment, the circuit is an SRAM having pull down transistors with higher performance.

Abstract: Embodiments relate to a bipolar transistor that includes a body region having a fin structure. At least one terminal region may be formed over at least a portion of the body region. The at least one terminal region may be formed as an epitaxially grown region. Embodiments also relate to a vertically integrated electronic device that includes a first terminal region, a second terminal region and a third terminal region. The second terminal region may be arranged over at least a portion of the third terminal region, and at least two of the first, second and third terminal regions may be formed as epitaxially grown regions.

Abstract: A circuit arrangement for detecting voltage changes, comprising supply terminals configured to apply a first potential and a second potential, a first oscillator and a second oscillator, which are operated with the first potential and the second potential, a voltage dependence of the frequency of the first oscillator differing from a voltage dependence of the frequency of the second oscillator, a first evaluation circuit configured to evaluate the frequency of the first oscillator and a second evaluation circuit configured to evaluate the frequency of the second oscillator, and a comparison circuit configured to compare a value based on the evaluated frequencies of the first oscillator and of the second oscillator with a predetermined threshold value, and to output a voltage change signal indicating an impermissible voltage change between the first potential and the second potential depending on the result of the comparison.

Abstract: An integrated circuit arrangement contains an insulating region, which is part of a planar insulating layer, and a capacitor which contains: near and far electrode regions near and remote from the insulating region and a dielectric region. The capacitor and an active component are on the same side of the insulating layer, and the near electrode region and an active region of the component are planar and parallel to the insulating layer. The near electrode region is monocrystalline and contains multiple webs.

Abstract: An integrated circuit, comprising a first data retention element configured to retain the data, the first data retention element having a first setup time, and a second data retention element configured to retain the data, the second data retention element having a second setup time, the second data retention element further having a data input. The second data retention element is connected in parallel with the first data retention element, and the second data retention element is configurable via the data input such that the second setup time is longer than the first setup time.

Abstract: An explanation is given of, inter alia, tunnel field effect transistors having a thicker gate dielectric (GD1) in comparison with other transistors (T2) on the same integrated circuit arrangement (10). As an alternative or in addition, said tunnel field effect transistors have gate regions at mutually remote sides of a channel forming region or an interface between the connection regions (D1, S1) of the tunnel field effect transistor.

Abstract: Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

Abstract: Embodiments of the invention are related to micromachine structures. In one embodiment, a micromachine structure comprises a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element comprises a FinFET structure having a height and a width, the height being greater than the width.

Abstract: The flip-flop according to the invention serves for storing an item of logic state information and has at least one data input and at least one data output. The flip-flop comprises at least one latch stage for storing the state information if the flip-flop is switched on. Furthermore, the flip-flop according to the invention comprises at least one memory cell having a capacitance as storage element. In this case, the at least one memory cell serves for storing the state information if the flip-flop is switched off.

Abstract: A device includes a first transistor including a fin and a second transistor including a fin, the fin of the first transistor having a lower charge carrier mobility than the fin of the second transistor. In a method, the fin of the first transistor is treated to have a lower charge carrier mobility than the fin of the second transistor.

Abstract: In a first embodiment, a multi-fin component arrangement has a plurality of multi-fin component partial arrangements. Each of the multi-fin component partial arrangements has a plurality of electronic components, which electronic components have a multi-fin structure. At least one multi-fin component partial arrangement has at least one dummy structure, which at least one dummy structure is formed between at least two of the electronic components formed in the at least one multi-fin component partial arrangement. The dummy structure is formed in such a way that electrical characteristics of the electronic components formed in the multi-fin component partial arrangements are adapted to one another.

Abstract: One aspect of the invention relates to a rectifier circuit for providing a rectified voltage, with a first AC voltage terminal to which an AC voltage can be applied, with a first DC voltage terminal to which a DC voltage can be provided, and with a control switching element between the first AC voltage terminal and the first DC voltage terminal. The control switching element only couples the first AC voltage terminal to the first DC voltage terminal if the electrical potential at the first AC voltage terminal has a predeterminable polarity compared with a reference potential and if the amount of the electrical potential at the first DC voltage terminal is less than or equal to the amount of the electrical potential at the first AC voltage terminal.