Patents by Inventor Christian Pils

Christian Pils has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Final passivation scheme for integrated circuits
    Patent number: 7307346
    Abstract: A semiconductor device includes a substrate with an active area. A last level interconnect capping layer is disposed over the active area. A buffer layer/crack stop layer overlies the last level interconnect capping layer and a passivation layer overlies the buffer layer/crack stop layer. Also, a contact pad (e.g., probe pad, wire bond pad or flip-chip pad) overlies the passivation layer.
    Type: Grant
    Filed: May 18, 2004
    Date of Patent: December 11, 2007
    Assignee: Infineon Technologies AG
    Inventors: Erdem Kaltalioglu, Christian Pils
  • Final passivation scheme for integrated circuits
    Publication number: 20050260842
    Abstract: A semiconductor device includes a substrate with an active area. A last level interconnect capping layer is disposed over the active area. A buffer layer/crack stop layer overlies the last level interconnect capping layer and a passivation layer overlies the buffer layer/crack stop layer. Also, a contact pad (e.g., probe pad, wire bond pad or flip-chip pad) overlies the passivation layer.
    Type: Application
    Filed: May 18, 2004
    Publication date: November 24, 2005
    Inventors: Erdem Kaltalioglu, Christian Pils