Abstract: In one embodiment, a surface analyzer system comprises a first radiation source to generate radiation at a first wavelength, a surface inspection assembly, and an edge detection assembly. In operation, the system enables contemporaneous surface inspection and edge detection.

Abstract: Systems and methods for inspecting a wafer with increased sensitivity are provided. One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.

Abstract: In one embodiment, a system to create a haze standard on a surface of an object, comprises a radiation targeting assembly that targets a radiation beam onto the surface of the object, a drive assembly to impart relative motion between the radiation targeting assembly and the surface of the object, and a controller to regulate the radiation targeting assembly to deliver radiation at a controlled power level to at least one portion of the surface, thereby forming at least one region having a known haze characteristic.

Abstract: An apparatus and associated method for reducing thermal damage on a specimen during an inspection which includes a radiation source for supplying a beam of radiation, and a means for adjusting a first energy level of the beam of radiation to a second energy level as the beam of radiation is variably positioned from a first location on the surface of the wafer to a second location on the surface of the wafer.

Abstract: Methods and systems for determining drift in a position of a light beam with respect to a chuck are provided. One method includes illuminating a surface with the light beam. The surface has a predetermined position with respect to the chuck during illumination. The method also includes generating signals responsive to the illumination of the surface and determining the drift in the position of the light beam with respect to the chuck using the signals. One system includes an illumination subsystem configured to illuminate a fiduciary with the light beam. The fiduciary has a predetermined position with respect to the chuck during illumination. This system also includes a detector configured to generate signals responsive to the illumination of the fiduciary and a processor configured to use the signals to determine the drift in the position of the light beam with respect to the chuck.

Abstract: A method and system for the augmentation of at least one task of a business process model are described, such augmentation including receiving a task-based authorization constraint to be applied to the at least one task. An augmented business process model is generated utilizing the business process model and the task-based authorization constraint. An authorization policy is automatically derived from the augmented business process model.

Abstract: One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.

Abstract: Systems and methods for inspecting a specimen with light at varying power levels are provided. One system configured to inspect a specimen includes a light source configured to generate light. The system also includes a power attenuator subsystem configured to alter a power level of the light directed to the specimen during inspection between at least two power levels including a full power level and a minimum power level equal to or greater than about 10% of the full power level. In addition, the system includes a detection subsystem configured to generate output responsive to the light scattered from the specimen. The output can be used to detect defects on the specimen.

Abstract: In one embodiment, a system to create a haze standard on a surface of an object, comprises a radiation targeting assembly that targets a radiation beam onto the surface of the object, a drive assembly to impart relative motion between the radiation targeting assembly and the surface of the object, and a controller to regulate the radiation targeting assembly to deliver radiation at a controlled power level to at least one portion of the surface, thereby forming at least one region having a known haze characteristic.

Abstract: Systems and methods for inspecting a wafer with increased sensitivity are provided. One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.

Abstract: Methods and systems for inspecting a specimen are provided. One method includes directing ultraviolet light to a specimen. The method also includes detecting light scattered from the specimen having a selected wavelength range. In addition, the method includes detecting features, defects, or light scattering properties of the specimen using signals representative of the detected light. One inspection system includes an illumination subsystem configured to direct ultraviolet light to a specimen. The system also includes a channel configured to detect light scattered from the specimen having a selected wavelength range. In addition, the system includes a processor configured to detect features, defects, or light scattering properties of the specimen using signals that are representative of the detected light.

Abstract: Systems and methods for inspecting a wafer with increased sensitivity are provided. One system includes an inspection subsystem configured to direct light to a spot on the wafer and to generate output signals responsive to light scattered from the spot on the wafer. The system also includes a gas flow subsystem configured to replace a gas located proximate to the spot on the wafer with a medium that scatters less of the light than the gas thereby increasing the sensitivity of the system. In addition, the system includes a processor configured to detect defects on the wafer using the output signals.

Abstract: Inspection systems, circuits, and methods are provided to enhance defect detection by reducing thermal damage to large particles by dynamically altering the incident laser beam power level supplied to the specimen during a surface inspection scan. In one embodiment, an inspection system includes an illumination subsystem for directing light to a specimen at a first power level, a detection subsystem for detecting light scattered from the specimen, and a power attenuator subsystem for dynamically altering the power level directed to the specimen based on the scattered light detected from the specimen. For example, the power attenuator subsystem may reduce the directed light to a second power level, which is lower than the first, if the detected scattered light exceeds a predetermined threshold level. In addition reducing thermal damage, the systems and methods described herein may be used to extend the measurement detection range of an inspection system by providing a variable-power inspection system.

Abstract: Inspection systems, circuits and methods are provided to enhance defect detection by addressing anode saturation as a limiting factor of the measurement detection range of a photomultiplier tube (PMT) detector. In accordance with one embodiment of the invention, a method for inspecting a specimen includes directing light to the specimen and detecting light scattered from the specimen. The step of detecting may include monitoring an anode current of the PMT detector, and detecting features, defects or light scattering properties of the specimen using the anode current until the anode current reaches a predetermined threshold. Thereafter, the method may use a dynode current of the PMT for detecting the features, defects or light scattering properties of the specimen.

Abstract: Inspection systems, circuits and methods are provided to enhance defect detection by addressing saturation levels of the amplifier and analog-digital circuitry as a limiting factor of the measurement detection range of an inspection system. In accordance with one embodiment of the invention, a method for inspecting a specimen includes directing light to the specimen and detecting light scattered from the specimen. However, the step of detecting may use only one photodetector for detecting the light scattered from the specimen and for converting the light into an electrical signal. The step of detecting also includes generating a first signal and a second signal in response to the electrical signal, where the second signal differs from the first. For example, the first signal may be generated to have a higher resolution than the second signal for detecting substantially lower levels of the scattered light.

Abstract: Methods and systems for determining drift in a position of a light beam with respect to a chuck are provided. One method includes illuminating a surface with the light beam. The surface has a predetermined position with respect to the chuck during illumination. The method also includes generating signals responsive to the illumination of the surface and determining the drift in the position of the light beam with respect to the chuck using the signals. One system includes an illumination subsystem configured to illuminate a fiduciary with the light beam. The fiduciary has a predetermined position with respect to the chuck during illumination. This system also includes a detector configured to generate signals responsive to the illumination of the fiduciary and a processor configured to use the signals to determine the drift in the position of the light beam with respect to the chuck.

Abstract: An apparatus and associated method for reducing thermal damage on a specimen during an inspection which includes a radiation source for supplying a beam of radiation, and a means for adjusting a first energy level of the beam of radiation to a second energy level as the beam of radiation is variably positioned from a first location on the surface of the wafer to a second location on the surface of the wafer.

Abstract: Methods for forming calibration standards for an inspection system and calibration standards are provided. One method includes scanning a first and a second specimen with an optical system. Master standard particles having a lateral dimension traceable to a national or international authority or first principles measurements are deposited on the first specimen. Product standard particles are deposited on the second specimen. In addition, the method includes determining a lateral dimension of the product standard particles by comparing data generated by scanning the two specimens. One calibration standard includes particles having a lateral dimension of less than about 100 nm deposited on a specimen. A distribution of the lateral dimension has a full width at half maximum of less than about 3%. The uncertainty of the lateral dimension is less than about 2%. Therefore, the standard meets the requirements for the 130 nm technology generation of semiconductor devices.