Patents by Inventor Christina Keith
Christina Keith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240148011Abstract: The invention relates to cheese and cheese-like products comprising about 0.2 to about 6% by weight ?s-casein, ?-casein, or a combination thereof, at least about 5% by weight of one or more hydrocolloids comprising one or more starches, and wherein the cheese or cheese-like product has one or more characteristics of a dairy product, such as flavour, taste, aroma, body, appearance, texture, firmness, handling, density, structure, coagulation, binding, leavening, aeration, foaming, emulsification, elasticity, viscoelasticity, melt, creaminess and mouthfeel.Type: ApplicationFiled: March 11, 2022Publication date: May 9, 2024Inventors: Christina June Puryer Coker, David Campbell Wemyss Reid, Jeremy Paul Hill, Andrew Keith Legg, Stephen Thomas Dybing, Leena Kishor, Samuel James Harper
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Publication number: 20220235219Abstract: A resin composition is provided which contains a mixture comprising a cycloaliphatic epoxy resin, a coupling agent, and an epoxy-containing compound, and/or a polycarbonate alcohol. Further, the resin composition contains a hardener component comprising a dicarboxylic anhydride, a dicarboxylic anhydride semi ester, an organic phosphite and an accelerator.Type: ApplicationFiled: May 5, 2020Publication date: July 28, 2022Inventors: Klaus HOEHN, Christina KEITH
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Patent number: 11211524Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.Type: GrantFiled: July 31, 2018Date of Patent: December 28, 2021Assignee: OSRAM OLED GmbHInventors: Daniel Leisen, Herbert Brunner, Emilia Dinu, Jens Eberhard, Christina Keith, Markus Pindl, Thomas Reeswinkel, Daniel Richter
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Patent number: 11038090Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.Type: GrantFiled: July 31, 2018Date of Patent: June 15, 2021Assignee: OSRAM OLED GmbHInventors: Daniel Leisen, Herbert Brunner, Emilia Dinu, Jens Eberhard, Christina Keith, Markus Pindl, Thomas Reeswinkel, Daniel Richter, Christopher Wiesmann, Ludwig Peyker, Alexander Linkov
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Publication number: 20210135068Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.Type: ApplicationFiled: July 31, 2018Publication date: May 6, 2021Inventors: Daniel Leisen, Herbert Brunner, Emilia Dinu, Jens Eberhard, Christina Keith, Markus Pindl, Thomas Reeswinkel, Daniel Richter, Christopher Wiesmann, Ludwig Peyker, Alexander Linkov
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Publication number: 20210126156Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; simultaneously spraying particles and a further material onto the cast surface, wherein a mixture of the further material and the particles includes a proportion of the particles of 20 percent by weight to 60 percent by weight, a portion of the particles remains at the cast surface, and a topography is created at the cast surface.Type: ApplicationFiled: July 31, 2018Publication date: April 29, 2021Inventors: Daniel Leisen, Herbert Brunner, Emilia Dinu, Jens Eberhard, Christina Keith, Markus Pindl, Thomas Reeswinkel, Daniel Richter
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Patent number: 10597512Abstract: An optoelectronic device with a mixture including silicone and a fluoro-organic additive is disclosed. In an embodiment the device includes at least one radiation-emitting or radiation-detecting semiconductor and a mixture including silicone and a fluoro-organic additive. The mixture may be a component of at least one of the following elements: a package body element surrounding the at least one semiconductor at least in places, a radiation-guiding element arranged in a beam path of a radiation emitted by the semiconductor or detected by the semiconductor, a heat-conducting element configured to conduct heat emitted by the semiconductor or received by the semiconductor, or an adhesive element.Type: GrantFiled: April 13, 2016Date of Patent: March 24, 2020Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Klaus Höhn, Kathy Schmidtke, Christina Keith
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Patent number: 10263164Abstract: The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one epoxy group. Additionally specified is a method of producing an optoelectronic component.Type: GrantFiled: February 4, 2016Date of Patent: April 16, 2019Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Christina Keith, Kathy Schmidtke, Klaus Hoehn
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Publication number: 20190040250Abstract: The invention relates to an epoxy resin system comprising at least one inorganic filler (F) which has an upper grain size (dmax) of a maximum of 30 ?m and is an oxide or nitride of a metal or a semimetal, at least one cycloaliphatic epoxy resin, polyvinyl butyrate, at least one cationic accelerator, and wherein the epoxy resin system is a one-component system for thin-walled structural elements.Type: ApplicationFiled: February 13, 2017Publication date: February 7, 2019Inventors: Klaus HOEHN, Christina KEITH
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Publication number: 20180100054Abstract: An optoelectronic device with a mixture including silicone and a fluoro-organic additive is disclosed. In an embodiment the device includes at least one radiation-emitting or radiation-detecting semiconductor and a mixture including silicone and a fluoro-organic additive. The mixture may be a component of at least one of the following elements: a package body element surrounding the at least one semiconductor at least in places, a radiation-guiding element arranged in a beam path of a radiation emitted by the semiconductor or detected by the semiconductor, a heat-conducting element configured to conduct heat emitted by the semiconductor or received by the semiconductor, or an adhesive element.Type: ApplicationFiled: April 13, 2016Publication date: April 12, 2018Inventors: Klaus Höhn, Kathy Schmidtke, Christina Keith
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Publication number: 20180033927Abstract: The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one epoxy group. Additionally specified is a method of producing an optoelectronic component.Type: ApplicationFiled: February 4, 2016Publication date: February 1, 2018Inventors: Christina KEITH, Kathy SCHMIDTKE, Klaus HOEHN
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Patent number: 9281458Abstract: An optoelectronic semiconductor device including a carrier substrate and at least one semiconductor chip arranged thereon, wherein the semiconductor chip includes an active layer that generates radiation, conductor tracks electrically contacting the semiconductor chip arranged on the carrier substrate, the semiconductor chip is enclosed in a potting material, and the potting material includes at least a first potting layer, a second potting layer and a third potting layer, which differ from one another in at least one of: their material composition, their optical properties and their chemical properties.Type: GrantFiled: June 20, 2012Date of Patent: March 8, 2016Assignee: OSRAM Opto Semiconductors GmbHInventors: Christina Keith, Bert Braune, Michael Kruppa
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Patent number: 9029901Abstract: An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.Type: GrantFiled: August 19, 2011Date of Patent: May 12, 2015Assignee: OSRAM Opto Semiconductors GmbHInventors: Johann Ramchen, Christina Keith, Bert Braune
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Patent number: 8883268Abstract: A method of producing a parylene coating on at least one surface of at least one component includes providing a first gas containing parylene monomers and depositing the parylene monomers on the at least one surface of the component by supplying the first gas containing the parylene monomers by a first nozzle to the at least one surface, wherein the component is disposed in an environment at atmospheric pressure.Type: GrantFiled: March 8, 2011Date of Patent: November 11, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Bert Braune, Christina Keith, Ivan Galesic
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Publication number: 20140217444Abstract: An optoelectronic semiconductor device including a carrier substrate and at least one semiconductor chip arranged thereon, wherein the semiconductor chip includes an active layer that generates radiation, conductor tracks electrically contacting the semiconductor chip arranged on the carrier substrate, the semiconductor chip is enclosed in a potting material, and the potting material includes at least a first potting layer, a second potting layer and a third potting layer, which differ from one another in at least one of: their material composition, their optical properties and their chemical properties.Type: ApplicationFiled: June 20, 2012Publication date: August 7, 2014Applicant: OSRAM Opto Semiconductors GmbHInventors: Christina Keith, Bert Braune, Michael Kruppa
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Publication number: 20130256737Abstract: An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.Type: ApplicationFiled: August 19, 2011Publication date: October 3, 2013Applicant: OSRAM OPTO SEMICONDUCTOR GmbHInventors: Johann Ramchen, Christina Keith, Bert Braune
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Publication number: 20130189447Abstract: A method of producing a parylene coating on at least one surface of at least one component includes providing a first gas containing parylene monomers and depositing the parylene monomers on the at least one surface of the component by supplying the first gas containing the parylene monomers by a first nozzle to the at least one surface, wherein the component is disposed in an environment at atmospheric pressure.Type: ApplicationFiled: March 8, 2011Publication date: July 25, 2013Applicant: OSRAM Opto Semiconductors GmbHInventors: Bert Braune, Christina Keith, Ivan Galesic