Abstract: A power semiconductor component is specified, having a power semiconductor device arranged within a housing, wherein a heat sink is exposed on a first surface of the housing; a wiring substrate which receives the housing with the power semiconductor device and which has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is arranged on the second main surface. The housing is arranged on the wiring substrate in such a way that the heat sink is connected to the heat dissipation region via a solder layer. A number of spacers which are arranged between the heat sink and the heat dissipation region are embedded in the solder layer. Furthermore, a method for producing a power semiconductor component is specified.

Abstract: A power semiconductor component includes at least one power semiconductor device disposed within a housing and a heat sink having an area a exposed on a first surface of the housing. A wiring substrate has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is disposed on the second main surface. The heat dissipation region has an area A on the second main surface, and a<A. The housing with the power semiconductor device is disposed on the second main surface of the wiring substrate in such a way that the heat sink is disposed completely on the heat dissipation region and is connected thereto by way of a solder layer. A method for producing a power semiconductor component is also provided.

Abstract: An aerosol generation device includes an aerosol generating substrate heated to form an aerosol. More specifically, an aerosol generation device includes: an aerosol generation chamber configured to receive and heat a substrate to generate aerosol, the aerosol generation chamber including at least a heating element; a cover which can be in a closed position covering an aperture in the device, and in an open position exposing the aperture; and a tray for receiving and holding the substrate.

Abstract: An aerosol generation device in which an aerosol generating substrate is heated to form an aerosol includes: an aerosol generation chamber configured to receive and heat a substrate to generate aerosol, the aerosol generation chamber including at least a heating element; an oblong housing; a cover which can be in a closed position covering the aerosol generation chamber and in an open position exposing the aerosol generation chamber; and a tray configured to receive and hold the substrate, the tray being connected to the cover.

Abstract: The present disclosure relates to an aerosol generation device in which an aerosol generating substrate is heated to form an aerosol. More specifically, an aerosol generation device comprises: an aerosol generation chamber configured to receive and heat a substrate to generate aerosol, the aerosol generation chamber comprising at least a heating element; cover which can be in a closed position covering an aperture in the device, and in an open position exposing said aperture; and a tray for receiving and holding the substrate.

Abstract: A mixer is used for producing multi-component pastes at a mixing ratio other than 1:1. A deviating channel 20 is provided between the inlet opening 16 for the component of the larger volume proportion and the mixing chamber, to delay the feed of this component with respect to the other component. The presence of this deviating channel 20 causes all components to enter the mixing chamber simultaneously, thereby obtaining a paste which has the desired mixing ratio from the start.