Abstract: One or more first portions of a reduced optical material wafer are covered with a masking layer that leaves uncovered one or more second portions of the reduced optical material wafer. The reduced optical material wafer is exposed to an oxidizing atmosphere to reverse a reduction of the one or more second portions of the reduced optical material wafer that makes the one or more second portions receptive for implementation of one or more optical waveguides.

Abstract: One or more first portions of a reduced optical material wafer are covered with a masking layer that leaves uncovered one or more second portions of the reduced optical material wafer. The reduced optical material wafer is exposed to an oxidizing atmosphere to reverse a reduction of the one or more second portions of the reduced optical material wafer that makes the one or more second portions receptive for implementation of one or more optical waveguides.

Abstract: One or more first portions of a reduced optical material wafer are covered with a masking layer that leaves uncovered one or more second portions of the reduced optical material wafer. The reduced optical material wafer is exposed to an oxidizing atmosphere to reverse a reduction of the one or more second portions of the reduced optical material wafer that makes the one or more second portions receptive for implementation of one or more optical waveguides.

Abstract: An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.

Abstract: One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.

Abstract: One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.

Abstract: An apparatus and method is provided for facilitating ionization of a gas medium of a laser gyroscope. The apparatus and method employ a solid state light emitting device as a start aid for the laser gyroscope. The solid state light emitting device has a wavelength at or below a threshold wavelength based on a work function of a cathode coating material to prompt ionization of a gas medium within the laser gyroscope.

Abstract: One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.

Abstract: An apparatus in one example comprises a wafer portion that comprises a conduction layer. Upon exposure of the conduction layer during a etch of the wafer portion, the conduction layer serves to dissipate a portion of a charge buildup on the wafer portion during an etch of the wafer portion.

Abstract: An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.

Abstract: One or more first portions of a reduced optical material wafer are covered with a masking layer that leaves uncovered one or more second portions of the reduced optical material wafer. The reduced optical material wafer is exposed to an oxidizing atmosphere to reverse a reduction of the one or more second portions of the reduced optical material wafer that makes the one or more second portions receptive for implementation of one or more optical waveguides.

Abstract: An apparatus in one example comprises a wafer portion that comprises a conduction layer. Upon exposure of the conduction layer during a etch of the wafer portion, the conduction layer serves to dissipate a portion of a charge buildup on the wafer portion during an etch of the wafer portion.

Abstract: One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.

Abstract: A photoresist spray coating process for deep trenched substrates. According to one implementation of the invention, the substrate surface is primed with a primer having a water contact angle between forty and fifty degrees. A spray nozzle is moved across the diameter of the substrate at varying speeds to achieve a coat of substantially the same thickness throughout. The photoresist is spray coated on the substrate surface at an angle to the substrate surface to obtain coverage of deep etched features. The photoresist is dissolved in a solvent according to specific dilution ratios to achieve a viscosity range that permits spraying the photoresist evenly in deep etch features while avoiding pull-back.