Patents by Inventor Christine Sanchez
Christine Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11981237Abstract: The invention relates to a padding for a motor vehicle seat having a sheet for measuring multizone pressure. The sheet has a flexible support layer, with a first electrode having first contact elements, a second electrode having second contact elements and a plurality of intermediate contact elements having piezoresistive properties, each of the intermediate elements being inserted between a first and a second element to form a plurality of pressure sensors. The support layer is made of mesh. The first electrode is made from conductive ink printed on the support layer. The second electrode is made from printed conductive ink, and the intermediate contact elements are made from printed conductive ink with less conductivity than the inks of the electrodes.Type: GrantFiled: October 9, 2019Date of Patent: May 14, 2024Assignee: TESCA FRANCEInventors: Mohamed Ben Lagha, Santi Sanchez, Christine Tonellato
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Patent number: 11505452Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.Type: GrantFiled: October 30, 2020Date of Patent: November 22, 2022Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
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Publication number: 20210047173Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.Type: ApplicationFiled: October 30, 2020Publication date: February 18, 2021Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
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Patent number: 10843918Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.Type: GrantFiled: March 4, 2019Date of Patent: November 24, 2020Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
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Publication number: 20190276306Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.Type: ApplicationFiled: March 4, 2019Publication date: September 12, 2019Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
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Patent number: 10221064Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.Type: GrantFiled: March 23, 2018Date of Patent: March 5, 2019Assignee: AMKOR TECHNOLOGY, INC.Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
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Publication number: 20180251369Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.Type: ApplicationFiled: March 23, 2018Publication date: September 6, 2018Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
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Patent number: 9932221Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.Type: GrantFiled: March 2, 2017Date of Patent: April 3, 2018Assignee: AMKOR TECHNOLOGY, INC.Inventors: Lawrence Prestousa Natan, Adrian Arcedera, Roveluz Lledo-Reyes, Sarah Christine-Sanchez Torrefranca
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Patent number: 6073833Abstract: The present invention relates to a container configured for shipping, storing, and displaying goods. The container comprises upper and lower portions linked by a continuous line of weakness, wherein the upper portions collectively form a container top section that can be easily and cleanly removed and disposed, while the lower portions collectively form a container bottom section that is retained for displaying contained articles. The container employs materials and design features that provide satisfactory protection during transportation, clamping and stacking.Type: GrantFiled: February 24, 1999Date of Patent: June 13, 2000Assignee: McNeil-PPC, Inc.Inventors: Marc Desrosiers, Luc Jette, Jean-Pierre Tremblay, Ullrich Flatmann, Christine Sanchez