Abstract: A method for producing a bonding pad for a micromechanical sensor element. The method includes: depositing a first metal layer onto a top face of the functional layer, and depositing a second metal layer onto the first metal layer, wherein only the first layer or only the second layer is formed in a border region extending around a bonding pad region; covering a protective layer over a top face of the second metal layer in the bonding pad region and over the first or second metal layer in an inner peripheral portion of the border region, which inner peripheral portion adjoins the bonding pad region; etching the first or second layer at least in an outer peripheral portion of the border region down to the top face of the functional layer; removing the protective layer; carrying out an etching process starting from the top face of the layered structure.

Abstract: A method for forming a trench in a first semiconductor layer of a multi-layer system. The method includes: applying a mask layer onto the first semiconductor layer, a recess being formed in the mask layer so that the first semiconductor layer is exposed within the recess; applying a protective layer which completely covers or modifies the first semiconductor layer exposed within the recess; applying a second semiconductor layer; etching the second semiconductor layer to completely remove it in a subarea surrounding the recess of the mask layer; etching the protective layer so that the first semiconductor layer is exposed within the recess; and forming the trench in the first semiconductor layer, the recess of the mask layer serving as an etching mask, and the trench being formed by a cyclical alternation between etching and passivation steps, the first etching step being longer than the subsequent etching steps.

Abstract: A micromechanical system which includes a movably suspended mass. The micromechanical system includes a damping system, the damping system including a movably suspended damping structure, the damping structure being deflectable by applying a voltage. The damping structure is designed in such a way that a frequency response and/or a damping of the movably suspended mass are/is changeable with the aid of a deflection of the damping structure.

Abstract: A micromechanical component having a main extension plane is provided; the micromechanical component encloses a first cavern and a second cavern, and a first pressure prevails in the first cavern while a second pressure prevails in the second cavern, and a first layer of the micromechanical component, which extends essentially parallel to the main extension plane, projects into a second layer of the micromechanical component, which extends essentially parallel to the main extension plane, between the first cavern and the second cavern, essentially in a perpendicular direction to the main extension plane.

Abstract: A micromechanical component having a main extension plane is provided; the micromechanical component encloses a first cavern and a second cavern, and a first pressure prevails in the first cavern while a second pressure prevails in the second cavern, and a first layer of the micromechanical component, which extends essentially parallel to the main extension plane, projects into a second layer of the micromechanical component, which extends essentially parallel to the main extension plane, between the first cavern and the second cavern, essentially in a perpendicular direction to the main extension plane.