Patents by Inventor Christoph Flötgen
Christoph Flötgen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10825793Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a reservoir in a surface layer on the first contact surface, the first surface layer consisting at least largely of a native oxide material, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: GrantFiled: April 8, 2011Date of Patent: November 3, 2020Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Patent number: 9252042Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: GrantFiled: January 25, 2011Date of Patent: February 2, 2016Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Patent number: 9159717Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence: forming a reservoir in a reservoir formation layer on the first contact surface, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, thinning of the second substrate and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with the second educt contained in the reaction layer of the second substrate.Type: GrantFiled: April 8, 2011Date of Patent: October 13, 2015Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20150165752Abstract: A method for bonding of a first contact area of a first substrate to a second contact area of a second substrate, the second substrate having a least one reaction layer, and a device for carrying out said method. The method comprises: (a) accommodating the substrates between a first electrode and a second electrode, or within a coil, (b) formation of a reservoir on the first contact area by exposing the first contact area to a plasma (c) at least partially filling of the reservoir with a first educt or a first group of educts, (d) contacting the first contact area with the second contact area for formation of a pre-bond interconnection, (e) forming a permanent bond between the first and second contact areas at least partially strengthened by the reaction of the first educt with a second educt which is contained in the reaction layer of the second substrate.Type: ApplicationFiled: July 24, 2012Publication date: June 18, 2015Applicant: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Patent number: 8975158Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises: forming at least one reservoir in at least one reservoir formation layer on the first substrate and/or the second substrate, the reservoir comprised of an amorphous material, at least partial filling of the reservoir/reservoirs with a first educt or a first group of educts, forming or applying a reaction layer which contains a second educt or a second group of educts to the reservoir and/or the reservoir, the first contact surface making contact with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt or the first group with the second educt or the second group.Type: GrantFiled: April 8, 2011Date of Patent: March 10, 2015Assignee: EV Group E. Thallner GmbHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20140073112Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises: forming at least one reservoir in at least one reservoir formation layer on the first substrate and/or the second substrate, the reservoir comprised of an amorphous material, at least partial filling of the reservoir/reservoirs with a first educt or a first group of educts, forming or applying a reaction layer which contains a second educt or a second group of educts to the reservoir and/or the reservoir, the first contact surface making contact with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt or the first group with the second educt or the second group.Type: ApplicationFiled: April 8, 2011Publication date: March 13, 2014Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20140051231Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate, the second substrate having at least one reaction layer, with the following steps, especially the following sequence: forming a reservoir in a reservoir formation layer on the first contact surface, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, thinning of the second substrate and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with the second educt contained in the reaction layer of the second substrate.Type: ApplicationFiled: April 8, 2011Publication date: February 20, 2014Applicant: EV GROUP E. THALLNER GMBHInventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20140017877Abstract: This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: forming a reservoir in a surface layer on the first contact surface, the first surface layer consisting at least largely of a native oxide material, at least partial filling of the reservoir with a first educt or a first group of educts, the first contact surface making contact with the second contact surface for formation of a prebond connection, forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: ApplicationFiled: April 8, 2011Publication date: January 16, 2014Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen
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Publication number: 20130299080Abstract: A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.Type: ApplicationFiled: January 25, 2011Publication date: November 14, 2013Inventors: Thomas Plach, Kurt Hingerl, Markus Wimplinger, Christoph Flötgen