Abstract: A soft switching device (sw) for connecting a power supply to at least one large electronic unit of an electronic system (1), so as to be activated via the soft switching device to the power supply. The device comprises a switch component (M1) with a control terminal and a current source (13) connected to the control terminal to control the switch component closure when the current source is activated. The soft switching device also includes a soft transition element (C1) of capacitive type between the output terminal (12) and the control terminal of the switch component (M1) so as to gradually close the switch for connection to a power supply.

Abstract: The invention provides novel compounds having the general formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R12, R13, R14, A1, A2, A3, n and m are as described herein.

Abstract: The invention provides novel compounds having the general formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R12, R13, R14, A1, A2, A3, n and m are as described herein.

Abstract: An electronic system is provided, including an integrated circuit die having at least 2 bond pads, and a redistribution layer having at least one solder pad including 2 portions separated from each other and configured to provide an electrical connection between each of the 2 portions by a solder ball disposed on the solder pad, and to electrically isolate the 2 portions in an absence of the solder ball on the solder pad, and at least 2 redistribution wires, each connecting a different one of the portions to a different one of the bond pads, a second bond pad being connected via a second redistribution wire to a second portion being dedicated to die testing; and a grounded printed circuit board track, wherein the solder ball is disposed between the solder pad and the track, and neither of the redistribution wires traverses a separation space between the 2 portions.

Abstract: An integrated circuit die having at least two bond pads, a redistribution layer, the redistribution layer including at least one solder pad including comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on the solder pad, but electrically isolated of each other in the absence of a solder ball on the solder pad at least two redistribution wires, each one connecting one of the two portions to one of the two bond pads, a first bond pad connected via a first redistribution wire to a first portion of the solder pad being dedicated to digital ground and a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to analog ground.

Abstract: An integrated circuit die having at least two bond pads, a redistribution layer, the redistribution layer including at least one solder pad including comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on the solder pad, but electrically isolated of each other in the absence of a solder ball on the solder pad at least two redistribution wires, each one connecting one of the two portions to one of the two bond pads, a first bond pad connected via a first redistribution wire to a first portion of the solder pad being dedicated to digital ground and a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to analog ground.

Abstract: The invention relates to an electronic system comprising: an integrated circuit die having: at least 2 bond pads a redistribution layer, said redistribution layer having: at least a solder pad comprising 2 portions arranged to enable an electrical connection between each other by a same solder ball placed on said solder pad, but electrically isolated of each other in the absence of a solder ball on the solder pad at least 2 redistribution wires, each one connecting one of the 2 portions to one of the 2 bond pads, a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to testing said integrated circuit die a grounded printed circuit board track, a solder ball being placed between the solder pad and the printed circuit board track.

Abstract: The invention provides novel compounds having the general formula (I) wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R12, R13, R14, A1, A2, A3, n and m are as described herein.

Abstract: The active transponder includes an input amplifier (26) arranged between an envelope detector (8) and a demodulation circuit (28). It further includes an activation unit (30) for the input amplifier and also for the demodulation circuit, which is formed by a frequency changer or mixer circuit (32), which decreases a significant modulation frequency of the modulated signal received by the antenna to a low frequency, the resulting low frequency signal then being amplified and filtered by low frequency elements. The activation unit thus consumes little electric power and sends a wake up signal to the elements operating at a high frequency when it detects said significant modulation frequency, in a very selective manner.

Abstract: The active transponder includes an input amplifier (26) arranged between an envelope detector (8) and a demodulation circuit (28). It further includes an activation unit (30) for the input amplifier and also for the demodulation circuit, which is formed by a frequency changer or mixer circuit (32), which decreases a significant modulation frequency of the modulated signal received by the antenna to a low frequency, the resulting low frequency signal then being amplified and filtered by low frequency elements. The activation unit thus consumes little electric power and sends a wake up signal to the elements operating at a high frequency when it detects said significant modulation frequency, in a very selective manner.

Abstract: A battery powered headworn communication device and a method for conversion of a battery voltage in a battery powered headworn communication device, which includes providing a voltage reduction to a fixed part of the input voltage and providing a variable reduction that ensures that a minimum voltage is maintained. Preferably, the fixed part reduction and the variable reduction are performed in parallel and the fixed voltage conversion is a ? conversion of the input voltage. A fixed voltage conversion and the variable conversion can be balanced according to the actual battery voltage.

Abstract: The invention relates to a method for conversion of a battery voltage in a battery powered headworn communication device, the method comprising providing a voltage reduction to a fixed part of the input voltage and providing a variable reduction that ensures that a minimum voltage is maintained. Preferably the fixed part reduction and the variable reduction are performed in parallel and the fixed voltage conversion is a 2/3 conversion of the input voltage. Also advantageous is it when a fixed voltage conversion and the variable voltage conversion are balanced according to the actual battery voltage. The invention further relates to a battery powered headworn communication device.