Patents by Inventor Christoph Riedesel

Christoph Riedesel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Charged particle beam system and method
    Patent number: 10896800
    Abstract: A charged particle beam system includes a charged particle source, a multi beam generator, an objective lens, a projection system, and a detector system. The projection system includes a first subcomponent configured to provide low frequency adjustments, and the projection system comprises a second subcomponent configured to provide a high frequency adjustments.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: January 19, 2021
    Assignee: Carl Zeiss MultiSEM GmbH
    Inventors: Christoph Riedesel, Dirk Zeidler
  • CHARGED PARTICLE BEAM SYSTEM AND METHOD
    Publication number: 20190355544
    Abstract: A charged particle beam system includes a charged particle source, a multi beam generator, an objective lens, a projection system, and a detector system. The projection system includes a first subcomponent configured to provide low frequency adjustments, and the projection system comprises a second subcomponent configured to provide a high frequency adjustments.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 21, 2019
    Inventors: Christoph Riedesel, Dirk Zeidler
  • Cross-section systems and methods
    Patent number: 8384029
    Abstract: A first instrument (230) is used to image a first semiconductor article having a trench (110) of defined cross-section, while a second instrument (220) is used to simultaneously prepare a second semiconductor article with a trench of defined cross-section. Furthermore, a method is disclosed to prepare a trench (110) of defined cross-section in a semiconductor article by rough milling and subsequent fine milling.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: February 26, 2013
    Assignee: Carl Zeiss NTS, LLC
    Inventors: Rainer Knippelmeyer, Lawrence Scipioni, Christoph Riedesel, John Morgan, Ulrich Mantz, Ulrich Wagemann
  • Repairing defects
    Patent number: 8334701
    Abstract: Methods and systems for defect repair are disclosed. The methods include: (a) identifying a defect causing an absence of an electrical connection between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the defect being positioned in the substrate; (b) removing a portion of the substrate to expose the defect, and depositing a conductive material to electrically connect the first and second circuit elements; and (c) verifying that the defect caused the absence of an electrical connection between the first and second circuit elements.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: December 18, 2012
    Assignee: Carl Zeiss NTS, LLC
    Inventors: Rainer Knippelmeyer, Christoph Riedesel, John Morgan, Lawrence Scipioni
  • CROSS-SECTION SYSTEMS AND METHODS
    Publication number: 20120085906
    Abstract: A first instrument (230) is used to image a first semiconductor article having a trench (110) of defined cross-section, while a second instrument (220) is used to simultaneously prepare a second semiconductor article with a trench of defined cross-section. Furthermore, a method is disclosed to prepare a trench (110) of defined cross-section in a semiconductor article by rough milling and subsequent fine milling.
    Type: Application
    Filed: June 16, 2009
    Publication date: April 12, 2012
    Applicant: CARL ZEISS NTS, LLC.
    Inventors: Rainer Knippelmeyer, Lawrence Scipioni, Christoph Riedesel, John Morgan, Ulrich Mantz, Ulrich Wagemann
  • REPAIRING DEFECTS
    Publication number: 20100052697
    Abstract: Methods and systems for defect repair are disclosed. The methods include: (a) identifying a defect causing an absence of an electrical connection between a first circuit element and a second circuit element, the first and second circuit elements being positioned in or on a substrate and the defect being positioned in the substrate; (b) removing a portion of the substrate to expose the defect, and depositing a conductive material to electrically connect the first and second circuit elements; and (c) verifying that the defect caused the absence of an electrical connection between the first and second circuit elements.
    Type: Application
    Filed: August 28, 2009
    Publication date: March 4, 2010
    Applicant: CARL ZEISS SMT INC.
    Inventors: Rainer Knippelmeyer, Christoph Riedesel, John Morgan, Lawrence Scipioni