Abstract: The present invention provides a drug eluting stent including a metallic stent framework, an electro-grafted primer coating disposed on the stent framework; and a biodegradable polymer coating hosting a drug disposed on the electro-grafted primer coating and a method of manufacturing said biodegradable drug eluting stent.

Abstract: The invention relates to a method for forming a polymer film on a surface that conducts or semiconducts electricity by means of electrografting. Said method uses an electrolytic solution containing a selected quantity of Brönsted acid. The invention also relates to the electrically conductive or semiconductive surfaces obtained by means of said method.

Abstract: The invention relates to a method for grafting an organic film onto an electically conductive or semiconductive surface by electro-reduction of a solution, wherein the solution comprises one diazonium salt and one monomer bearing at least one chain polymerizable functional group. During the electrolyzing process, at least one protocole consisting of an electrical polarization of the surface by applying a variable potential over at least a range of values which are more cathodic that the reduction or peak potential of all diazonium salts in said solution is applied. The invention also relates to an electrically conducting or semiconducting surface obtained by implementing this method. The invention further relates to electrolytic compositions.

Abstract: The present invention concerns a lining support comprising a plurality of conductive pads (12) associated with a shared addressing contact (18) and means of selecting at least one pad to be lined by electrochemical means among the plurality of pads. In accordance with the invention, the selection means comprise means (20) of shifting a polarisation voltage, connected between the shared addressing contact and at least one pad to be addressed. Application to the lining of conductive pads.

Abstract: An electromechanical microstructure including a first mechanical part formed in a first electrically conductive material, and which includes a zone deformable in an elastic manner having a thickness value and an exposed surface, and a first organic film having a thickness, present on all of the exposed surface of the deformable zone. The thickness of the first film is such that the elastic response of the deformable zone equipped with the first film does not change by more than 5% compared to the response of the bare deformable zone, or the thickness of the first film is less than ten times the thickness of the deformable zone.

Abstract: The present invention relates to a method for cladding a simple or complex surface, electrically conducting or semiconducting, by means of an organic film from at least one precursor of said organic film, characterized in that the cladding of the surface by the organic film is carried out by electro-initiated grafting of said, at least one, precursor of said surface by applying at least one potential sweep on this surface carried out in such a way that at any point of said surface the maximum potential of each potential sweep, in absolute value and relative to a reference electrode, is greater than or equal to the value of the potential (vbloc) from which the curves of a graph expressing the quantity of electro-grafted precursor on a surface identical to said surface in function of the number of potential sweeps are all superposed and independent of this vbloc potential.

Abstract: The present invention relates to a process for coating a surface of a substrate with a seed film of a metallic material, the said surface being an electrically conductive or semiconductive surface and having recesses and/or projections. The process comprises the following: an organic film is placed on the said surface, the said film having a thickness such that the free face of this film conformally follows the recesses and/or projections of the said electrically conductive or semiconductive surface on which it is placed; a precursor of the metallic material is inserted within the said organic film placed on the said surface at the same time as, or after, the step consisting in placing the said organic film on the said surface; and the said precursor of the metallic material inserted within the said organic film is converted into the said metallic material. This process allows integrated circuits, interconnects in microelectronics and microsystems to be fabricated.

Abstract: The invention relates to the deposition or attachment of materials to surfaces. It relates to a process for coating a surface with a first material and a second material, comprising the following steps: placing the first material on the said surface, inserting into the first material placed on the said surface precursor molecules of the second material, converting the said precursor molecules of the second material inserted into the first material into the said second material such that this second material becomes formed on the said surface to be coated and within the said first material placed on the said surface. The object of the process of the invention is to allow the deposition of materials of any type onto surfaces of any type.

Abstract: The present invention relates to a method for cladding a simple or complex surface, electrically conducting or semiconducting, by means of an organic film from at least one precursor of said organic film, characterised in that the cladding of the surface by the organic film is carried out by electro-initiated grafting of said, at least one, precursor of said surface by applying at least one potential sweep on this surface carried out in such a way that at any point of said surface the maximum potential of each potential sweep, in absolute value and relative to a reference electrode, is greater than or equal to the value of the potential (vbloc) from which the curves of a graph expressing the quantity of electro-grafted precursor on a surface identical to said surface in function of the number of potential sweeps are all superposed and independent of this vbloc potential.

Abstract: The present invention concerns a lining support comprising a plurality of conductive pads (12) associated with a shared addressing contact (18) and means of selecting at least one pad to be lined by electrochemical means among the plurality of pads. In accordance with the invention, the selection means comprise means (20) of shifting a polarisation voltage, connected between the shared addressing contact and at least one pad to be addressed. Application to the lining of conductive pads.

Abstract: The invention concerns a solid support comprising a functionalized electricity conductor or semiconductor surface coated with a functionalized electrografted organic layer wherein at least 90% of the number of functional groups of interest is accessible. The invention also concerns the method for preparing such a support and uses thereof, in particular as adhesive primer for fixing molecules of interest or objects bearing a complementary function (molecular adhesive).

Abstract: The invention relates to a method of bonding a polymer surface to an electrically conductive or semiconductive surface, which method is characterized in that it comprises: a) the electrografting of an organic film onto the conductive or semiconductive surface; and then b) an operation of bonding the polymer surface to the conductive or semiconductive surface thus grafted. It also relates to applications of this method and to structures obtained by its implementation.

Abstract: An electromechanical microstructure including a first mechanical part formed in a first electrically conductive material, and which includes a zone deformable in an elastic manner having a thickness value and an exposed surface, and a first organic film having a thickness, present on all of the exposed surface of the deformable zone. The thickness of the first film is such that the elastic response of the deformable zone equipped with the first film does not change by more than 5% compared to the response of the bare deformable zone, or the thickness of the first film is less than ten times the thickness of the deformable zone.

Abstract: The invention relates to a method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting. The invention also relates to the electricity conducting- or semi-conducting-surfaces obtained using the aforementioned method and to the applications of same.

Abstract: The present invention relates to a substrate coated with a transparent organic film, to a process for the manufacture of this substrate coated with the transparent organic film and to its use. The substrate coated with a film is characterized in that the film is an electrical insulator organic polymer which is transparent in at least one wavelength range and in that the said film is combined with a label which emits at least in the said wavelength range. It has an application in particular in a means for the detection of a chemical entity, for example a biochip, in a process for the quality control, a process for the certification or a process for the authentication of an object.

Abstract: The present invention relates to a process for grafting and growing a conductive organic film on(to) an electrically conductive or semiconductive surface in which the grafting and growing of the film are performed simultaneously by electro-reduction of a diazonium salt that is a precursor of the said film on(to) the said surface cathodically polarized at a potential greater than or equal, in absolute value, to the electro-reduction potential of the diazonium salt relative to a reference electrode.

Abstract: The invention concerns a mask-free localised grafting of organic molecules capable of being electrically activated, on a composite surface comprising conductive and/or semiconductive portions, by contacting said organic molecules with said composite surface, whereby the grafting is carried out electrochemically in one single step on specific selected zones of said conductive and/or semiconductive portions, said zones being brought to a potential not less than an electric potential threshold determined relative to a reference electrode, said electric potential threshold being the potential beyond which the grafting of said organic molecules occurs.

Abstract: A process for mask-free localized grafting of organic molecules capable of being electrically activated, onto a composite surface comprising conductive and/or semiconductive portions, by placing said organic molecules in contact with said composite surface, in which said grafting is performed electrochemically in a single step on chosen, defined areas of said conductive and/or semiconductive portions, said areas being brought to a potential higher than or equal to a threshold electrical potential determined relative to a reference electrode, said threshold electrical potential being the potential above which grafting of said organic molecules takes place.

Abstract: The present invention relates to a complexing structure, to a method for treating liquid effluent using said complexing structure, and to a device for implementing the method of the invention. The structure comprises a film of a polymer or of an electrically neutral organic copolymer.

Abstract: The invention relates to a bioactive implant comprising a substrate coated with a polymer layer with reactive functions, and a bioactive substance fixed on the implant by means of said reactive functions to enable progressive release on the implant site. Such implants are useful in the field of cardiology for example to prevent restenosis resulting from the fitting of stents in the coronary arteries.