Patents by Inventor Christophe Lorant

Christophe Lorant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for dicing a semiconductor substrate into a plurality of dies
    Patent number: 11476162
    Abstract: A method is provided for dicing a semiconductor substrate into a plurality of dies, the semiconductor substrate having a front side including a plurality of device areas, a back side, and a plurality of through substrate vias. The method includes defining, from the front side, at least one trench to be formed between adjacent device areas, forming the at least one trench, from the front side of the semiconductor substrate, arranging a protective layer on the front side of the semiconductor substrate, thinning the semiconductor substrate from the back side to reduce the thickness of the semiconductor substrate, processing the back side of the semiconductor substrate to form at least one contact, the contact contacting at least one through substrate via, etching through the minor portion of the thickness of the semiconductor substrate underneath the at least one trench, and dicing the semiconductor substrate into the plurality of dies.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: October 18, 2022
    Assignee: Imec VZW
    Inventors: Frank Holsteyns, Eric Beyne, Christophe Lorant, Simon Braun
  • Method for Dicing a Semiconductor Substrate into a Plurality of Dies
    Publication number: 20210098299
    Abstract: A method is provided for dicing a semiconductor substrate into a plurality of dies, the semiconductor substrate having a front side including a plurality of device areas, a back side, and a plurality of through substrate vias. The method includes defining, from the front side, at least one trench to be formed between adjacent device areas, forming the at least one trench, from the front side of the semiconductor substrate, arranging a protective layer on the front side of the semiconductor substrate, thinning the semiconductor substrate from the back side to reduce the thickness of the semiconductor substrate, processing the back side of the semiconductor substrate to form at least one contact, the contact contacting at least one through substrate via, etching through the minor portion of the thickness of the semiconductor substrate underneath the at least one trench, and dicing the semiconductor substrate into the plurality of dies.
    Type: Application
    Filed: September 30, 2020
    Publication date: April 1, 2021
    Inventors: Frank Holsteyns, Eric Beyne, Christophe Lorant, Simon Braun