Abstract: Various data capture assemblies and methods are provided. In one embodiment, a data capture assembly is provided that includes a bolster plate with an aperture attached to a multi-chip module. A pad array is disposed on the multi-chip module and is exposed through the aperture. An interposer is electrically coupled to the pad array on the multi-chip module, and a translator board is electrically coupled to the interposer. A logical analyzer interface is electrically coupled to the translator board.

Abstract: An auto-contactor system and method are provided for optimizing the size and placement of contact elements for connecting signal lines from one layer of an integrated circuit to another layer of the integrated circuit. The auto-contactor system includes a contact area mechanism and an optimizing mechanism. The contact area mechanism identifies a contact area that overlaps the signal line from the first layer of the integrated circuit and the signal line on the second layer of the integrated circuit. The optimizing mechanism calculates an optimal size of a plurality of contacts in the contact area.

Abstract: A power-sense circuit for use in an integrated circuit provides an indication when back-up battery power is lost when the integrated circuit main power supply was off. The power-sense circuit is fully integrated within the integrated circuit and includes a battery sensor, a main power sensor, a latch, and an output coupled to the latch which provides a power-sense signal which is at a first binary state when back-up battery power had been lost and a second binary state indicating that main power had been reinstated to the integrated circuit.

Abstract: A novel test die for emulating the thermal characteristics of functional product dies includes a plurality of concentric emulator ring configurations fabricated about the die center, each having a plurality of heating resistors approximately forming a rectangle, a plurality of sense diodes located in proximity to the heating resistors and a plurality of hot spot resistors located in proximity to both the heating resistors and the sense diodes. Metallic interconnections are formed on the die which selectively provide each of the heating resistors and hot spot resistors with excitation signals and present signals from the sense diodes indicative of the voltage thereacross.

Abstract: An improved gate array employs long strips of gates instead of current blocks. Isolation of selected adjacent circuits is provided by connecting positions of the area between transistor gates to VCC or ground. Room for passage of connecting lines across a column is provided by shifting the positions of circuits along a column to open a sufficient quantity of unused gates.