Abstract: A bonded structure for testing a semiconductor device and a method for testing semiconductor devices is disclosed. The bonded structure may comprise a testing element and one or more semiconductor element. The testing element may comprise a testing circuitry. The testing element may be bonded to a semiconductor device or embedded within a semiconductor device. The testing element may be configured to test the semiconductor device. The testing element may be configured to test a first semiconductor device to which it is bonded as well as other semiconductor devices bonded to the first semiconductor device.

Abstract: The disclosed technology relates to microelectronic devices that can dissipate heat efficiently. In some aspects, such a microelectronic device includes a first semiconductor element and at least one second semiconductor element disposed on the first semiconductor element. Such a microelectronic device may further include a thermal block disposed on the first semiconductor element and adjacent to the at least one second semiconductor element. The thermal block may include a conductive thermal pathway to transfer heat from the first semiconductor element to a heat sink disposed on the thermal block. In some embodiments, a coefficient of thermal expansion (CTE) of the thermal block is less than 10 ?m/m° C. In some embodiments, a thermal conductivity of the thermal block is higher than 150 Wm-1K-1. at room temperature.

Abstract: The disclosed technology relates to microelectronic devices that can dissipate heat efficiently. In some aspects, such a microelectronic device includes a first semiconductor element and at least one second semiconductor element disposed on the first semiconductor element. The microelectronic device may further include a fluidic cooling unit disposed on the first semiconductor element. In some embodiment, the fluidic cooling unit may include a cavity structure to contain a fluid. In some embodiment, the fluidic cooling unit may include a thermal pathway to transfer heat away from the first semiconductor element.

Abstract: A bonded structure with protective semiconductor elements including a semiconductor element with active circuitry and a protective element including an obstructive layer and/or a protective circuitry layer. The obstructive layer is configured to inhibit external access to at least a portion of the active circuitry. The protective circuitry layer is configured to detect or disrupt external access to the protective element and/or the active circuitry of the semiconductor element. The semiconductor element and the protective element are directly bonded without an adhesive along a bonding interface.

Abstract: A user on-demand fuel delivery system can include at least one fill vehicle having a fuel tank connected to an electronically readable fuel flow meter; and at least one server configured to receive user instructions for refill of a fuel tank, including actual or anticipated location of the fuel tank, and a time window for fuel refill, wherein the at least one server selects one of the fill vehicles and provides route and time information to the fill vehicle for refill of the fuel tank; wherein the electronically readable fuel flow meter provides fuel delivery volume data to the at least one server, and a payment receipt is generated. Interfaces and corresponding methods are also disclosed.

Abstract: An image capturing device may include a detector including a plurality of sensing pixels, and an optical system adapted to project a distorted image of an object within a field of view onto the sensing pixels, wherein the optical system expands the image in a center of the field of view and compresses the image in a periphery of the field of view, wherein a first number of sensing pixels required to realize a maximal zoom magnification {circumflex over (Z)} at a minimum resolution of the image capturing device is less than a square of the maximal zoom magnification times a second number of sensing pixels required for the minimum resolution.

Abstract: An optical system (302) has a plurality of optical surfaces (304, 305, 306, 307, 308, 309) configured to provide blurred images of objects located within a selected range of object distances. At least two of the plurality of optical surfaces are configured to contribute to the blurring. An imaging system (300) includes a blurring optical system (302), a sensor (310) which receives light directed through the optical system, and an image processor (320) which selects one or more deblurring functions and applies the deblurring functions to provide a processed image. The processor may apply different deblurring functions to different sets of the raw data representing different portions of the field of view.

Abstract: An image capturing device may include a detector including a plurality of sensing pixels, and an optical system adapted to project a distorted image of an object within a field of view onto the sensing pixels, wherein the optical system expands the image in a center of the field of view and compresses the image in a periphery of the field of view, wherein a first number of sensing pixels required to realize a maximal zoom magnification {circumflex over (Z)} at a minimum resolution of the image capturing device is less than a square of the maximal zoom magnification times a second number of sensing pixels required for the minimum resolution.

Abstract: Micromirror devices, especially for use in digital projection are disclosed. Other applications are contemplated as well. The devices employ a superstructure that includes a mirror supported over a hinge set above a substructure. Various improvements to the superstructure over known micromirror devices are provided. The features described are applicable to improve manufacturability, enable further miniaturization of the elements and/or to increase relative light return. Devices can be produced utilizing the various optional features described herein, possibly offering cost savings, lower power consumption, and higher resolution.

Abstract: A reliable micromirror device for imaging applications is presented. The device includes a projection lens assembly and an array of micromirrors for fast and efficient color separation and projection. Each of the micromirrors simultaneously receives a plurality of light beams. The position of a micromirror in the array of micromirrors is adjustable such that the micromirror selects one of the plurality of light beams to direct toward the projection lens assembly. Each micromirror also has an “off” position where none of the reflected light beams is directed toward the projection lens assembly. An image is formed when each of the micromirrors in the array either directs one of the light beams toward the projection lens assembly or is turned “off.” The device may include a total internal reflection prism assembly that separates the light beams for improved contrast.

Abstract: Micromirror devices, especially for use in digital projection are disclosed. Other applications are contemplated as well. The devices employ a superstructure that includes a mirror supported over a hinge set above a substructure. Various improvements to the superstructure over known micromirror devices are provided. The features described are applicable to improve manufacturability, enable further miniaturization of the elements and/or to increase relative light return. Devices can be produced utilizing the various optional features described herein, possibly offering cost savings, lower power consumption, and higher resolution.

Abstract: Micromirror devices, especially for use in digital projection are disclosed. Other applications are contemplated as well. The devices employ a superstructure that includes a mirror supported over a hinge set above a substructure. Various improvements to the superstructure over known micromirror devices are provided. The features described are applicable to improve manufacturability, enable further miniaturization of the elements and/or to increase relative light return. Devices can be produced utilizing the various optional features described herein, possibly offering cost savings, lower power consumption, and higher resolution.

Abstract: A method (and system) for manufacturing an optical switching device. The method includes forming an array plate comprising at least one hundred sites from a first physical process, where each of the sites is for coupling to an optical fiber. The sites have a first spatial degree of error relative to an ideal mathematical grid of the sites. The first spatial degree of error is derived from at least the first physical process. The method forms a lens plate comprising a plurality of lenses from a second physical process. Each of the lenses is going to be coupled to at least one of the sites on the array plate. The lenses have a second spatial degree of error relative to a second mathematical grid of lenses. The second spatial degree of error is derived from at least the second physical process. The method then derives lens measurement values from each of the plurality of lenses.