Patents by Inventor Christopher B. Hundley

Christopher B. Hundley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • First inter-layer dielectric stack for non-volatile memory
    Patent number: 8435898
    Abstract: A method and apparatus are described for forming a first inter-layer dielectric (ILD0) stack having a protective gettering layer (72) with a substantially uniform thickness. After forming device components (32, 33) on a substrate (31), a gap fill dielectric layer of SATEOS (52) is deposited over an etch stop layer of PEN ESL (42) and then planarized before sequentially depositing a gettering layer of BPTEOS (72) and capping dielectric layer (82) on the planarized gap fill dielectric layer (52). Once the ILD0 stack is formed, one or more contact openings (92, 94, 96) are etched through the ILD0 stack, thereby exposing the etch stop layer (42) over the intended contact regions.
    Type: Grant
    Filed: April 5, 2007
    Date of Patent: May 7, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Olubunmi O. Adetutu, Christopher B. Hundley, Paul A. Ingersoll, Craig T. Swift
  • First inter-layer dielectric stack for non-volatile memory
    Publication number: 20080248649
    Abstract: A method and apparatus are described for forming a first inter-layer dielectric (ILD0) stack having a protective gettering layer (72) with a substantially uniform thickness. After forming device components (32, 33) on a substrate (31), a gap fill dielectric layer of SATEOS (52) is deposited over an etch stop layer of PEN ESL (42) and then planarized before sequentially depositing a gettering layer of BPTEOS (72) and capping dielectric layer (82) on the planarized gap fill dielectric layer (52). Once the ILD0 stack is formed, one or more contact openings (92, 94, 96) are etched through the ILD0 stack, thereby exposing the etch stop layer (42) over the intended contact regions.
    Type: Application
    Filed: April 5, 2007
    Publication date: October 9, 2008
    Inventors: Olubunmi O. Adetutu, Christopher B. Hundley, Paul A. Ingersoll, Craig T. Swift