Abstract: A tool for cleaning semiconductor wafers includes a cleaning head with a flat face bounded by an edge. A tubular drive shaft is connected to the cleaning head and provides a conduit through which a cleaning fluid can flow. An opening into the shaft is provided in the flat face which also has a plurality of channels to distribute the cleaning fluid across the flat face. A brush is formed as a single piece of porous, elastic material with a substrate portion that has a first major surface abutting the cleaning head face. A lip of the brush extends from the substrate portion around the edge of the flat face to removably secure the brush to the cleaning head. The brush has a plurality of cylindrical nubs on the second major surface forming projections for scrubbing surfaces of semiconductor wafers.