Abstract: A microresistivity logging tool includes a monopole current injection electrode and at least first and second pairs of potential electrodes. The tool may further include a controller configured for making microresistivity anisotropy measurements using a single firing of the monopole current injection electrode. The controller may be configured to compute a two-dimensional tensor of the local formation resistivity from a single firing of the monopole current injection electrode. The use of a single firing tends to decrease measurement time, which in turn tends to improved azimuthal sensitivity in microresistivity anisotropy imaging while drilling applications.

Abstract: A method for making directional resistivity measurements includes sequentially transmitting first and second axial and transverse electromagnetic waves in a borehole and receiving substantially pure axial and transverse components of each of the transmitted waves. A composite ratio of the received components is computed and may be utilized as an indicator of various formation parameters. The invention advantageously provides for the acquisition of compensated directional resistivity measurements.

Abstract: A microresistivity logging tool includes a monopole current injection electrode and at least first and second pairs of potential electrodes. The tool may further include a controller configured for making microresistivity anisotropy measurements using a single firing of the monopole current injection electrode. The controller may be configured to compute a two-dimensional tensor of the local formation resistivity from a single firing of the monopole current injection electrode. The use of a single firing tends to decrease measurement time, which in turn tends to improved azimuthal sensitivity in microresistivity anisotropy imaging while drilling applications.

Abstract: A method for making directional resistivity measurements includes sequentially transmitting first and second axial and transverse electromagnetic waves in a borehole and receiving substantially pure axial and transverse components of each of the transmitted waves. A composite ratio of the received components is computed and may be utilized as an indicator of various formation parameters. The invention advantageously provides for the acquisition of compensated directional resistivity measurements.

Abstract: A method for polishing computer rigid disks comprising bringing at least one surface of the rigid disk into contact with a polishing pad and applying a composition to the rigid disk comprising at least one hydroxylamine additive and colloidal silica to give polished rigid disk.

Abstract: Chemical mechanical polishing compositions and slurries comprising a film-forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features.

Abstract: A polishing composition comprising a dispersion of silane-modified abrasive particles formed by combining at least one metal oxide abrasive having at least one surface metal hydroxide with at least one silane compound and methods for polishing substrate features such as metal features and oxide features using the polishing compositions.

Abstract: Chemical mechanical polishing compositions and slurries comprising a film-forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features.

Abstract: Chemical mechanical polishing compositions and slurries comprising a film forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features.

Abstract: A polishing composition comprising a dispersion of silane modified abrasive particles formed by combining at least one metal oxide abrasive having at least one surface metal hydroxide with at least one silane compound and methods for polishing substrate features such as metal features and oxide features using the polishing compositions.

Abstract: A method for polishing computer rigid disks comprising bringing at least one surface of the rigid disk into contact with a polishing pad and applying a composition to the rigid disk comprising at least one hydroxylamine additive and colloidal silica to give a polished rigid disk.

Abstract: A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal features associated with integrated circuits and other electronic devices.

Abstract: A method for polishing computer rigid disks comprising bringing at least one surface of the rigid disk into contact with a polishing pad and applying a composition to the rigid disk comprising at least one hydroxylamine additive and colloidal silica to give a polished rigid disk.

Abstract: A chemical mechanical polishing composition comprising a composition capable of etching tungsten and at least one inhibitor of tungsten etching and methods for using the composition to polish tungsten containing substrates.

Abstract: A chemical mechanical polishing composition comprising a composition capable of etching tungsten and one inhibitor of tungsten etching and methods for using the composition to polish tungsten containing substrates.

Abstract: A chemical mechanical polishing precursor comprising at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when admixed with an oxidizing agent prior to use to remove metal layers from a substrate.

Abstract: A method for polishing computer rigid disks comprising bringing at least one surface of the rigid disk into contact with a polishing pad and applying a dispersion to the rigid disk to give a polished rigid disk having an rms roughness less than about 1.4 nm. Also disclosed is a dispersion and polishing slurry for polishing rigid disks.

Abstract: A chemical mechanical polishing slurry comprising an oxidizing agent, a fluoride containing additive and an abrasive and a method for using the fluoride containing additive chemical mechanical polishing slurry to remove tungsten and titanium from substrates.

Abstract: A chemical mechanical polishing composition comprising an oxidizing agent at least one catalyst having multiple oxidation states, and at least one stabilizer, the composition being useful when combined with an abrasive or with an abrasive pad to remove metal layers from a substrate.

Abstract: A chemical mechanical polishing composition comprising an oxidizing agent and at least one catalyst having multiple oxidation states, the composition being useful when combined with an abrasive or with an abrasive pad to remove metal layers from a substrate.