Abstract: An interposer to couple a microelectronic device package to a motherboard is formed from a PCB substrate. Multiple via holes are drilled through a copper-clad PCB substrate and then coated inside with copper. The copper surface coating is etched to form multiple traces In one embodiment, the substrate is cut through each row of via holes and between each row of via holes to produce multiple individual beam-and-trace interposers. Two or more such interposers may be affixed together to form a beam-and-trace interposer array. Alternatively, the substrate is not cut into strips, and each via hole is filled completely with a conductive material to form an array of solid conductive columns through the substrate.

Abstract: The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.

Abstract: An interposer to couple a microelectronic device package to a motherboard is formed from a PCB substrate. Multiple via holes are drilled through a copper-clad PCB substrate and then coated inside with copper. The copper surface coating is etched to form multiple traces. In one embodiment, the substrate is cut through each row of via holes and between each row of via holes to produce multiple individual beam-and-trace interposers. Two or more such interposers may be affixed together to form a beam-and-trace interposer array. Alternatively, the substrate is not cut into strips, and each via hole is filled completely with a conductive material to form an array of solid conductive columns through the substrate.

Abstract: A zero mounting force solder-free connector/component and method.

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed.

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed.

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.

Abstract: A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

Abstract: A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board and placing solder on the pad in a predetermined pattern. The solder may be heated so as to create reflow. The solder may later be examined to determine if the solder is lead-free.

Abstract: An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

Abstract: A compliant member configured to support a substrate during automated placement of components and a tray configured to support the compliant member and removably attach to a support member.

Abstract: A compliant member configured to support a substrate during automated placement of components and a tray configured to support the compliant member and removably attach to a support member.

Abstract: A first strip and a second strip of metal are embedded on a first layer of a printed circuit board (PCB) to form a junction. The junction has a first strip tail and a second strip tail. The first strip and the second strip are made of different metals. A first trace and a second trace are fabricated on a second layer to extend the junction to a first trace pad and a second trace pad, respectively. The first and second traces are fabricated on a second layer. The first and second traces have a first end one and a second end one, respectively. The first end one is connected to the first strip using a first via and the second end one is connected to the second strip using a second via. A first wire is inserted to the first via and a second wire to the second via to measure the temperature of the PCB.

Abstract: A first strip and a second strip of metal are embedded on a first layer of a printed circuit board (PCB) to form a junction. The junction has a first strip tail and a second strip tail. The first strip and the second strip are made of different metals. A first trace and a second trace are fabricated on a second layer to extend the junction to a first trace pad and a second trace pad, respectively. The first and second traces are fabricated on a second layer. The first and second traces have a first end one and a second end one, respectively. The first end one is connected to the first strip using a first via and the second end one is connected to the second strip using a second via. A first wire is inserted to the first via and a second wire to the second via to measure the temperature of the PCB.