Patents by Inventor Christopher David Combs

Christopher David Combs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190103289
    Abstract: Apparatus and methods are provided to reduce warpage of an integrated circuit package while reflowing solder to couple a first substrate of a first electronic device with a second substrate or second electronic device. In an example, the method can include placing an anti-warpage fixture onto the first electronic device to provide a captured electronic device, placing the captured electronic device and the anti-warpage fixture on the second substrate, and reflowing the captured electronic device to the second substrate. In certain examples, the method can include limiting a clearance distance between the first substrate and the second substrate to a minimum distance.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 4, 2019
    Inventors: Christopher David Combs, Steven Vandervoort
  • Patent number: 5671530
    Abstract: A vertical wafer compact flip chip feeder device includes a loading station for providing a loading location where a flip chip wafer having first and second planar surfaces is received such that the first and second planar surfaces are substantially perpendicular to a first plane. The flip chip feeder device further includes a pick-up station for providing a pick-up location where individual flip chips are retrieved from the flip chip wafer. A wafer translating assembly translates the flip chip wafer between the loading and pick-up stations with the first and second planar surfaces of the flip chip wafer remaining substantially perpendicular to the first plane. A chip pick-up assembly retrieves the individual flip chips from the flip chip wafer at the pick-up station and flips the individual flip chips to a flipped position such that first and second planar surfaces of the individual flip chips are substantially parallel with the first plane.
    Type: Grant
    Filed: October 30, 1995
    Date of Patent: September 30, 1997
    Assignee: Delco Electronics Corporation
    Inventors: Christopher David Combs, Andrew Russell Baker, Steven Lee Davidson, Thomas Rezsonya