Abstract: Instruments, methods, and kits are disclosed for performing fast thermocycling.

Abstract: Systems, methods, and apparatuses are provided for self-contained nucleic acid preparation, amplification, and analysis.

Abstract: In nano-imprint lithography it is important to detect thickness non-uniformity of a residual layer formed on a substrate. Such non-uniformity is compensated such that a uniform residual layer may be formed. Compensation is performed by calculating a corrected fluid drop pattern.

Abstract: A holder for mixing a container of paint is disclosed. The system comprising a body having a cover and a base. The system also comprises an aperture in the cover of the body. The system also comprises a cavity in the body and accessible through the aperture and configured to receive the container. The density of the body corresponds to the density of the container of paint. A system for holding and mixing a container of paint having a lid secured to a first body is also disclosed. A system for holding and mixing a first container of paint having a first volume and a second container of paint having a second volume less than the first volume is also disclosed.

Abstract: A system for mixing paint and for holding a container of paint having a cover engaging a body is disclosed. The system comprises a rotary mixer comprising a holder configured for receiving the container. The system also comprises a clamp comprising an arm configured to pivot from a first position to a second position and a plate configured for positioning between a first linear position and a second linear position. The plate in the second linear position maintains the engagement of the cover of the container to the body by compression to inhibit leakage of the paint. A method of mixing paint with a rotary mixer is also disclosed.

Abstract: An insert for a container includes an outer wall, a upstanding spout, and a bottom wall. The outer wall is configured to fit within an opening of the container and defines the periphery of the insert. The outer wall has a lower edge and an upper edge that is disposed at a first elevation. The upstanding spout is located within the outer wall and includes at least one substantially straight portion. The straight portion has a lower edge as well as a substantially straight upper edge that is disposed at a second elevation less than the first elevation. The bottom wall connects the lower edge of the outer wall and the lower edge of the spout to form a channel between the outer wall and the spout.

Abstract: A system for mixing paint and for holding a container of paint having a cover engaging a body is disclosed. The system comprises a rotary mixer comprising a holder configured for receiving the container. The system also comprises a clamp comprising an arm configured to pivot from a first position to a second position and a plate configured for positioning between a first linear position and a second linear position. The plate in the second linear position maintains the engagement of the cover of the container to the body by compression to inhibit leakage of the paint. A method of mixing paint with a rotary mixer is also disclosed.

Abstract: A method of manufacturing a hermetic package. In one embodiment, the method includes: (1) forming a plurality of contact-sensitive electronic devices on a device substrate, each of the plurality of devices having an active surface, (2) providing a mounting substrate, (3) forming a grid of dam material between the device substrate and the mounting substrate that is pitched as a function of lateral dimensions of the plurality of devices, (4) bringing the device substrate and the mounting substrate together until the active surface of each of the plurality of devices is proximate, but spaced apart from, the mounting substrate, the mounting substrate and the dam material cooperating to form packages for the plurality of devices and (5) dicing the device substrate to separate the packages.

Abstract: A hermetic package for an electronic device, such as a surface acoustic wave (SAW) device and a method of manufacturing the same. In one embodiment, the package includes: (1) a device substrate having: (a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device, (b) a contact region surrounding the active region and containing bond pads that are electrically coupled to the pattern and (c) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and a footprint smaller than a footprint of the device substrate and (3) a bonding agent, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that bonds the device substrate to the mounting substrate to enclose the active region proximate a void between the device substrate and the mounting substrate, the contact region remaining exposed.

Abstract: The present invention provides a surface acoustic wave (SAW) circuit package including: (1) a substantially planar piezoelectric substrate having an active surface, (2) an electronic circuit located over the active surface, (3) an encapsulant substrate having a bonding surface and (4) a bonding material interposing and creating a hermetic seal between the active surface and the bonding surface and around a void between the piezoelectric substrate and the encapsulant substrate. In one embodiment, the void has lateral dimensions at least equaling a footprint of the electronic circuit.

Abstract: A hermetic package for a pyroelectric-sensitive electronic device and methods of manufacturing one or more of such packages. In one embodiment, the package includes: (1) a device substrate having: (1a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device and (1b) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and (3) a nonmetallic hermetic sealing adhesive, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of the device, the active region proximate a void between the device substrate and the mounting substrate.