Patents by Inventor Christopher J. Dominic

Christopher J. Dominic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser marking passivation film for semiconductor package
    Publication number: 20040145060
    Abstract: An adhesive film having a light colored layer and a dark colored layer is applied to the non-active face of a silicon wafer to protect the wafer when it is singulated into individual dies. The protective film is thick enough to allow laser marking of the die, such that the light colored layer shows through the laser etching of the dark colored layer.
    Type: Application
    Filed: January 23, 2003
    Publication date: July 29, 2004
    Inventor: Christopher J. Dominic
  • Adhesive wafers for die attach application
    Patent number: 6620651
    Abstract: Fabrication of a CSP or a stacked chip CSP can be accomplished with an unsupported film adhesive or an adhesive supported on a rigid carrier, using standard die attach equipment constructed for use with a paste adhesive.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: September 16, 2003
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Xiping He, Christopher J. Dominic
  • Adhesive wafers for die attach application
    Publication number: 20030087479
    Abstract: Fabrication of a CSP or a stacked chip CSP can be accomplished with an unsupported film adhesive or an adhesive supported on a rigid carrier, using standard die attach equipment constructed for use with a paste adhesive.
    Type: Application
    Filed: October 23, 2001
    Publication date: May 8, 2003
    Inventors: Xiping He, Christopher J. Dominic
  • Method of preparing an electronic package by co-curing adhesive and encapsulant
    Patent number: 5972735
    Abstract: A semi-conductor package in which an integrated circuit chip is connected to a substrate using wire-bonding is prepared by curing the die attach adhesive and encapsulating the wire bonds in one heating step. The encapsulant composition has a curing chemistry and a curing profile compatible with those of the adhesive.
    Type: Grant
    Filed: July 14, 1998
    Date of Patent: October 26, 1999
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Christopher J. Dominic