Abstract: A spring-loaded assembly for coupling a connector to a computer component includes an assembly housing operable to receive a portion of a screw used to couple the connector to a chassis of an information handling system. The assembly further includes a sliding block disposed in the assembly housing and operably engaged with the screw. The sliding block is operable to move the connector between a first position and a second position. The assembly further includes a spring placed between the sliding block and at least one wall of the assembly housing. The spring operably provides an axial force to bias the connector to a first position, whereby coupling the connector to the computer component causes the connector to move to a connected position intermediate the first and second position.

Abstract: An apparatus that has housing for containing objects. The housing has two heat-conducting partial-boundaries having an interface between them. The apparatus also has a medium for enhancing heat transfer across the interface.

Abstract: A heat sink is provided that has a leg and a member coupled substantially perpendicular to the leg at a first end of the leg. The leg is surface mountable to a first surface of a printed circuit board at a second end of the leg to receive heat from an electronic device on a second surface of the printed circuit board by a thermally conductive via through the printed circuit board.

Abstract: An apparatus that has housing for containing objects. The housing has two heat-conducting partial-boundaries having an interface between them. The apparatus also has a medium for enhancing heat transfer across the interface.

Abstract: A heat sink is provided that has a leg and a member coupled substantially perpendicular to the leg at a first end of the leg. The leg is surface mountable to a first surface of a printed circuit board at a second end of the leg to receive heat from an electronic device on a second surface of the printed circuit board by a thermally conductive via through the printed circuit board.

Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

Abstract: An electronic component cooling system for printed circuit board enclosures includes a plurality of fans, each coupled to an air deflection unit which selectively forces air from the fans through the printed circuit boards. The system includes at least one thermal diffuser and at least one air concentrator. The thermal diffuser is placed between a stack of two or more shelving units to avoid the development of hot spots or dead zones. The air concentrator provides the ability for certain components which have a high heat output to receive a greater amount of air flow than other components which have lower heat outputs.

Abstract: A battery heater uses the internal resistance of the battery as the battery heating element. In one embodiment, a DC battery charger and a programmable battery load, is used in a closed loop temperature control system. In another embodiment, a DC battery charger and a resistor or small auxiliary battery heater, is used in a closed loop temperature control system. The programmable load or the small auxiliary battery heater, is enabled during full charge, low temperature conditions. The resistor or small auxiliary heater serves to both heat the battery and draw down the battery charge. In yet another embodiment, an AC heater power supply and a DC battery charger, is coupled to the battery in a closed loop temperature control system.

Abstract: A packaging scheme for an expandable electronic system or sub-system unit which minimizes cabinet interconnection structure whereby electrical signal connections are bifurcated and may be made to and from electronic component carrying printed circuit boards, whereof, inter-board connections may be made off of one edge of each board while input/output interface connections may be made off of another edge of each board.