Abstract: A method of manufacturing a porous silicon (PSi) includes providing a semiconductor wafer; depositing a mask layer on a first side of the semiconductor wafer; patterning the mask layer to expose portions of semiconductor material of the semiconductor wafer; depositing a metal layer onto the patterned mask layer on a second side of the semiconductor wafer; and etching the semiconductor wafer where exposed by patterned portions of any of the mask layer and the metal layer thereby creating PSi regions at a surface of the semiconductor wafer. The method may further include patterning the metal layer prior to etching to form at least one electrode. The etching may include etching the semiconductor wafer with HF, a solvent, and hydrogen peroxide. The metal layer may form a plurality of electrodes segmented from each other.

Abstract: A method and apparatus for self-assembling a part on a substrate are disclosed herein. In some embodiments, a method includes placing a substrate having a first binding site capable of generating a first magnetic field and having a first shaped surface with a first droplet conformably disposed thereon into a first fluid; placing a part having a second binding site capable of generating a second magnetic field and having a second shaped surface with a second droplet conformably disposed on the second shaped surface into the first fluid; and attracting the part towards the first binding site such that an equilibrium is formed between an attractive force and a repulsive force such that the part is free to rotate about the first binding site to minimize the repulsive force when the first and second shaped surfaces rotate into an alignment causing the part to aligned with the first binding site.

Abstract: A method and apparatus for self-assembling a part on a substrate are disclosed herein. In some embodiments, a method includes placing a substrate having a first binding site capable of generating a first magnetic field and having a first shaped surface with a first droplet conformably disposed thereon into a first fluid; placing a part having a second binding site capable of generating a second magnetic field and having a second shaped surface with a second droplet conformably disposed on the second shaped surface into the first fluid; and attracting the part towards the first binding site such that an equilibrium is formed between an attractive force and a repulsive force such that the part is free to rotate about the first binding site to minimize the repulsive force when the first and second shaped surfaces rotate into an alignment causing the part to aligned with the first binding site.