Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

Abstract: Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload.

Abstract: Various embodiments of methods and systems for optimizing processing performance in a multi-functional portable computing device (“PCD”) are disclosed. Depending on how the PCD is being used, the temperature limit associated with the touch temperature of the PCD may be variable. As such, a preset and fixed touch temperature limit based on a “worst use case” scenario can unnecessarily limit the quality of service (“QoS”) provided to a user under different use case scenarios. Accordingly, embodiments of the systems and methods define and recognize different device definitions for the PCD which are each associated with certain use cases and each dictate different temperature thresholds or limits subject to which the PCD may run.

Abstract: Methods, systems, and devices are described for managing power of a user equipment (UE). A UE modem may determine the state of charge of the battery to determine that the battery is in one of two or more charge state levels, and may invoke one or more modem power saving modes based on the charge state level. Power saving modes may include, for example, reducing a number of available receive chains in a UE, initiating a time delay between one or more frequency scan requests performed by the UE, reducing a rate of neighbor search requests performed by the UE, providing a buffer status report (BSR) parameter that indicates a reduced amount of buffer data relative to an actual amount of buffer data for the UE, and/or adjusting a maximum transmit power level for an uplink channel.

Abstract: Thermal management in a portable computing device differentiates between a temperature increase caused by a steady workload and a temperature increase caused by an instantaneous workload. If it is determined that a detected temperature increase is caused by a steady workload, then a configuration of thermal parameters is applied that optimizes thermal performance for a steady workload. If it is determined that a temperature increase is caused by an instantaneous workload increase, then a configuration of thermal parameters is applied that optimizes thermal performance for an instantaneous workload.

Abstract: A system and method for reducing heat in a portable computing device includes clocking a processor such that it is provided with a full frequency over time t0 to t1. A timer is set to trigger a forced power collapse (“FPC”) that removes all power to the processor from time t1 to time t2. At time t2, the processor may be awakened such that it can resume processing at the full frequency. Advantageously, during the FPC, no leakage power (“PL”) is consumed by the processor between t1 and t2. The result is that the processor averages the same processing efficiency over time t0 to t2 as it otherwise would have if a reduced frequency had been provided to it. However, because no PL was consumed during the FPC, the generation of heat between time t1 and t2 that is related to PL is avoided.

Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

Abstract: Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

Abstract: A temperature of a component within the portable computing device (PCD) may be monitored along with a parameter associated with the temperature. The parameter associated with temperature may be an operating frequency, transmission power, or a data flow rate. It is determined if the temperature has exceeded a threshold value. If the temperature has exceeded the threshold value, then the temperature is compared with a temperature set point and a first error value is then calculated based on the comparison. Next, a first optimum value of the parameter is determined based on the first error value. If the temperature is below or equal to the threshold value, then a present value of the parameter is compared with a desired threshold for the parameter and a second error value is calculated based on the comparison. A second optimum value of the parameter may be determined based on the second error value.

Abstract: Methods, systems, and devices are described for managing power of a user equipment (UE). A UE modem may determine the state of charge of the battery to determine that the battery is in one of two or more charge state levels, and may invoke one or more modem power saving modes based on the charge state level. Power saving modes may include, for example, reducing a number of available receive chains in a UE, initiating a time delay between one or more frequency scan requests performed by the UE, reducing a rate of neighbor search requests performed by the UE, providing a buffer status report (BSR) parameter that indicates a reduced amount of buffer data relative to an actual amount of buffer data for the UE, and/or adjusting a maximum transmit power level for an uplink channel.

Abstract: Various embodiments of methods and systems for optimizing processing performance in a multi-functional portable computing device (“PCD”) are disclosed. Depending on how the PCD is being used, the temperature limit associated with the touch temperature of the PCD may be variable. As such, a preset and fixed touch temperature limit based on a “worst use case” scenario can unnecessarily limit the quality of service (“QoS”) provided to a user under different use case scenarios. Accordingly, embodiments of the systems and methods define and recognize different device definitions for the PCD which are each associated with certain use cases and each dictate different temperature thresholds or limits subject to which the PCD may run.

Abstract: A system and method for reducing heat in a portable computing device includes clocking a processor such that it is provided with a full frequency over time t0 to t1. A timer is set to trigger a forced power collapse (“FPC”) that removes all power to the processor from time t1 to time t2. At time t2, the processor may be awakened such that it can resume processing at the full frequency. Advantageously, during the FPC, no leakage power (“PL”) is consumed by the processor between t1 and t2. The result is that the processor averages the same processing efficiency over time t0 to t2 as it otherwise would have if a reduced frequency had been provided to it. However, because no PL was consumed during the FPC, the generation of heat between time t1 and t2 that is related to PL is avoided.