Patents by Inventor Christopher Lee Schutte

Christopher Lee Schutte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP POLISHER HEAD OVER-ROTATION RESTRICTOR
    Publication number: 20230166382
    Abstract: A CMP tool including a polisher head with an over-rotation restrictor mechanism is operative to counteract a rotational difference between an inner body of the polisher head and an outer body of the polisher head that are coupled by a rolling seal. In one arrangement, the over-rotation restrictor mechanism comprises a plurality of rotation lock pins provided with a rotational component of the polisher head, e.g., the outer body, and a corresponding plurality of restrictor receptacles provided with another rotational component of the polisher head, e.g., the inner body, wherein the rotation lock pins may be engaged with respective restrictor receptacles for arresting the rotational difference between the two rotational components.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 1, 2023
    Inventors: John Wirt Hornbrook, Christopher Lee Schutte
  • PERMEATED GROOVING IN CMP POLISHING PADS
    Publication number: 20160101501
    Abstract: A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.
    Type: Application
    Filed: December 18, 2015
    Publication date: April 14, 2016
    Inventors: Christopher Lee Schutte, Prakash Lakshmikanthan
  • Permeated grooving in CMP polishing pads
    Patent number: 9308620
    Abstract: A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: April 12, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Christopher Lee Schutte, Prakash Lakshmikanthan
  • PERMEATED GROOVING IN CMP POLISHING PADS
    Publication number: 20150079886
    Abstract: A polishing pad for polishing a semiconductor wafer or other materials, having grooves in the polishing pad to enhance the usable lifetime of the polishing pad.
    Type: Application
    Filed: September 18, 2013
    Publication date: March 19, 2015
    Applicant: Texas Instruments Incorporated
    Inventors: Christopher Lee Schutte, Prakash Lakshmikanthan