Patents by Inventor Christopher M. Cork

Christopher M. Cork has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7984395
    Abstract: A method of increasing hierarchy compression of a metal 1 standard cell layout during optical proximity correction (OPC) is provided. This method can use a context determination defined from the outermost OPC correctable-edge boundaries of a metal 1 standard cell and not extending past outermost OPC correctable edge boundaries of adjacent metal 1 standard cells in other rows. The method can also include (or can alternatively include) adjusting the landing pads (resulting from metal 2 placement) to fit within the lines of the metal 1 standard cell layout. This adjusting can be performed by a place and route tool as part of a “clean-up” operation after metal 2 placement. The landing pads can be sized for single or double vias. A layout design for the metal 1 standard cell layout can be output based on using the context determination and/or adjusting the landing pads for hierarchy compression.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: July 19, 2011
    Assignee: Synopsys, Inc.
    Inventor: Christopher M. Cork
  • Publication number: 20090187871
    Abstract: A method of increasing hierarchy compression of a metal 1 standard cell layout during optical proximity correction (OPC) is provided. This method can use a context determination defined from the outermost OPC correctable-edge boundaries of a metal 1 standard cell and not extending past outermost OPC correctable edge boundaries of adjacent metal 1 standard cells in other rows. The method can also include (or can alternatively include) adjusting the landing pads (resulting from metal 2 placement) to fit within the lines of the metal 1 standard cell layout. This adjusting can be performed by a place and route tool as part of a “clean-up” operation after metal 2 placement. The landing pads can be sized for single or double vias. A layout design for the metal 1 standard cell layout can be output based on using the context determination and/or adjusting the landing pads for hierarchy compression.
    Type: Application
    Filed: January 17, 2008
    Publication date: July 23, 2009
    Applicant: Synopsys, Inc.
    Inventor: Christopher M. Cork