Patents by Inventor Christopher M. Desana

Christopher M. Desana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip system with organic/inorganic hybrid underfill composition
    Patent number: 7332822
    Abstract: A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: February 19, 2008
    Assignee: Delphi Technologies, Inc.
    Inventors: Rafil Basheer, Richard M. Laine, Santy Sulaiman, Chad M. Brick, Christopher M. Desana