Patents by Inventor Christopher M. Pickett
Christopher M. Pickett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6737265Abstract: Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is disclosed.Type: GrantFiled: September 12, 2002Date of Patent: May 18, 2004Assignee: Tessera, Inc.Inventors: Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M. Pickett, John Smith
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Patent number: 6627478Abstract: A microelectronic assembly is made by bonding the tip ends of leads on a first element to bonding contacts on a second element. The tip ends of the leads are releasably connected to the first element, so that the leads are held in place during the bonding process. After bonding, the first and second elements are heated or cooled to cause differential thermal expansion, which breaks at least some of the releasable attachments of the tip ends, leaving the leads free to flex.Type: GrantFiled: May 3, 2001Date of Patent: September 30, 2003Assignee: Tessera, Inc.Inventors: John W. Smith, Christopher M. Pickett
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Publication number: 20030060032Abstract: Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is disclosed.Type: ApplicationFiled: September 12, 2002Publication date: March 27, 2003Inventors: Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M. Pickett, John Smith
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Patent number: 6384475Abstract: A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The top and bottom elements are moved away from one another, thereby breaking the frangible elements and deforming the leads towards a vertically extensive disposition. A flowable composition such as dielectric material may be injected around the leads during or after the moving step. The resulting unit may be used to form permanent or temporary connections between microelectronic elements.Type: GrantFiled: March 27, 2000Date of Patent: May 7, 2002Assignee: Tessera, Inc.Inventors: Masud Beroz, Belgacem Haba, Christopher M. Pickett
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Patent number: 6361959Abstract: Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are released from the support structure by degrading the connecting layer. The support structure desirably has a predictable, isotropic coefficient of thermal expansion and such coefficient of thermal expansion may be close to that of silicon to minimize the effect of the temperature changes. The conductive elements may be mounted on a plurality of individual tiles rather than on an unitary sheet covering an entire wafer to minimize dimensional changes when the dielectric is released from the support structure.Type: GrantFiled: May 24, 1999Date of Patent: March 26, 2002Assignee: Tessera, Inc.Inventors: Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M. Pickett, John Smith
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Patent number: 6358780Abstract: A semiconductor chip package includes a semiconductor chip having surfaces and contacts, a layer of a moisture-permeable material bonded to one surface of the chip and a moisture-impermeable encapsulant overlying the moisture-permeable material and at least partially surrounding the chip. The package has exposed exterior surfaces and terminals on at least one of the exposed exterior surfaces which are electrically connected to the contacts. The moisture-permeable material extends to at least one of the exposed exterior surfaces so that moisture may be vented through the moisture-permeable material and out of the package. In certain embodiments, the moisture-permeable material includes a compliant layer having silicone and the moisture-impermeable material includes an epoxy.Type: GrantFiled: May 1, 2000Date of Patent: March 19, 2002Assignee: Tessera, Inc.Inventors: John W. Smith, Christopher M. Pickett
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Publication number: 20020009827Abstract: Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are released from the support structure by degrading the connecting layer. The support structure desirably has a predictable, isotropic coefficient of thermal expansion and such coefficient of thermal expansion may be close to that of silicon to minimize the effect of the temperature changes. The conductive elements may be mounted on a plurality of individual tiles rather than on an unitary sheet covering an entire wafer to minimize dimensional changes when the dielectric is released from the support structure.Type: ApplicationFiled: September 24, 2001Publication date: January 24, 2002Inventors: Masud Beroz, Joseph Fjelstad, Belgacem Haba, Christopher M. Pickett, John Smith
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Publication number: 20010055866Abstract: A microelectronic assembly is made by bonding the tip ends of leads on a first element to bonding contacts on a second element. The tip ends of the leads are releasably connected to the first element, so that the leads are held in place during the bonding process. After bonding, the first and second elements are heated or cooled to cause differential thermal expansion, which breaks at least some of the releasable attachments of the tip ends, leaving the leads free to flex.Type: ApplicationFiled: May 3, 2001Publication date: December 27, 2001Inventors: John W. Smith, Christopher M. Pickett
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Patent number: 6208025Abstract: A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.Type: GrantFiled: October 6, 1999Date of Patent: March 27, 2001Assignee: Tessera, Inc.Inventors: Pieter H. Bellaar, Thomas H. Distefano, Joseph Fjelstad, Christopher M. Pickett, John W. Smith
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Patent number: 6080932Abstract: A semiconductor chip package includes a semiconductor chip having surfaces and contacts, a layer of a moisture-permeable material bonded to one surface of the chip and a moisture-impermeable encapsulant overlying the moisture-permeable material and at least partially surrounding the chip. The package has exposed exterior surfaces and terminals on at least one of the exposed exterior surfaces which are electrically connected to the contacts. The moisture-permeable material extends to at least one of the exposed exterior surfaces so that moisture may be vented through the moisture-permeable material and out of the package. In certain embodiments, the moisture-permeable material includes a compliant layer having silicone and the moisture-impermeable material includes an epoxy.Type: GrantFiled: April 14, 1998Date of Patent: June 27, 2000Assignee: Tessera, Inc.Inventors: John W. Smith, Christopher M. Pickett
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Patent number: 6063648Abstract: A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The top and bottom elements are moved away from one another, thereby breaking the frangible elements and deforming the leads towards a vertically extensive disposition. A flowable composition such as dielectric material may be injected around the leads during or after the moving step. The resulting unit may be used to form permanent or temporary connections between microelectronic elements.Type: GrantFiled: October 29, 1998Date of Patent: May 16, 2000Assignee: Tessera, Inc.Inventors: Masud Beroz, Belgacem Haba, Christopher M. Pickett
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Patent number: 6002168Abstract: A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.Type: GrantFiled: November 25, 1997Date of Patent: December 14, 1999Assignee: Tessera, Inc.Inventors: Pieter H. Bellaar, Thomas H. DiStefano, Joseph Fjelstad, Christopher M. Pickett, John W. Smith